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1. WO2020112741 - ENHANCED HEAT CONDUCTION COMPONENTS

Publication Number WO/2020/112741
Publication Date 04.06.2020
International Application No. PCT/US2019/063207
International Filing Date 26.11.2019
IPC
F16L 59/065 2006.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
16ENGINEERING ELEMENTS OR UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
LPIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
59Thermal insulation in general
06Arrangements using an air layer or vacuum
065using vacuum
F28F 13/00 2006.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
13Arrangements for modifying heat transfer, e.g. increasing, decreasing
H01L 23/34 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
CPC
F16L 59/065
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
LPIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
59Thermal insulation in general
06Arrangements using an air layer or vacuum
065using vacuum
F28F 13/00
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
13Arrangements for modifying heat-transfer, e.g. increasing, decreasing
H01L 23/427
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
42Fillings or auxiliary members in containers ; or encapsulations; selected or arranged to facilitate heating or cooling
427Cooling by change of state, e.g. use of heat pipes
Applicants
  • CONCEPT GROUP LLC [US]/[US]
Inventors
  • RADHAKRISHNAN, Shriram
  • REID, David, H, Jr.
  • REID, Aarne, H.
  • ROACH, Peter
  • PYE, Lucas
Agents
  • RABINOWITZ, Aaron, B.
Priority Data
62/771,35426.11.2018US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) ENHANCED HEAT CONDUCTION COMPONENTS
(FR) COMPOSANTS DE CONDUCTION THERMIQUE AMÉLIORÉE
Abstract
(EN)
Provided are heat transfer components that include a wick and a working fluid enclosed within a sealed evacuated space. Also provided are related methods of using the components.
(FR)
L'invention concerne des composants de transfert de chaleur qui comprennent une mèche et un fluide de travail enfermé à l'intérieur d'un espace sous vide scellé. L’invention concerne en outre des procédés associés d’utilisation des composants.
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