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1. WO2020112569 - HIGH DENSITY COIL DESIGN AND PROCESS

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[ EN ]

CLAIMS

What is claimed is:

1. A device comprising:

a substrate; and

a plurality of coil portions disposed on the substrate, the plurality of coil portions electrically coupled to form a coil structure.

2. The device of claim 1, wherein the coil structure forms a C- Shape coil structure.

3. The device of claim 1, wherein the coil portions are surface mount coils.

4. The device of claim 3, wherein the coil portions are electrically coupled with a trace on the substrate through a solder joint.

5. The device of claim 1, wherein the substrate is a circuit board.

6. The device of claim 2 including a bridge.

7. The device of claim 6, wherein the bridge is formed of adhesive.

8. The device of claim 1, wherein at least one of the one or more coil portions includes a trace jumper integrated with the coil portion.

9. The device of claim 1, wherein the substrate is formed of a plurality of portions.

10. The device of claim 9, wherein at least one of the plurality of portions include an assembly tab.

11. A structure comprising:

a substrate; and

a plurality of surface mount circuits, the plurality of surface mount circuits disposed on the substrate and electrically coupled to each other.

12. The coil structure of claim 11, wherein at least one of the plurality of surface mount circuits is a surface mount coil.

13. The coil structure of claim 11, wherein at least one of the plurality of surface mount circuits includes a circuit solder pad.

14. The coil structure of claim 13, wherein the substrate includes a solder joint.

15. The coil structure of claim 14, wherein the solder joint includes a substrate solder pad exposed in a void formed in the substrate and the circuit solder pad.

16. The coil structure of claim 15, wherein the solder joint further includes solder disposed on the circuit solder pad and the substrate solder pad.

17. The coil structure of claim 11, wherein the substrate includes a center portion coupled to an outer portion by one or more connecting portions, at least one of the plurality of surface mount circuits disposed on the center portion.

18. The coil structure of claim 11, wherein one or more terminal pads are disposed on the outer portion and the one or more terminal pads are coupled with at least one of the plurality of surface mount circuits disposed on the center portion by one or more traces disposed in part on at least one of the one or more connecting portions.

19. The structure of claim 11, wherein the substrate includes at least one out-of-plane portion such that the substrate is non-planar.

20. The structure of claim 11, wherein at least one of the plurality of surface mount circuits is disposed on the out-of-plane portion.