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1. WO2020112569 - HIGH DENSITY COIL DESIGN AND PROCESS

Publication Number WO/2020/112569
Publication Date 04.06.2020
International Application No. PCT/US2019/062883
International Filing Date 23.11.2019
IPC
H01F 5/04 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
5Coils
04Arrangements of electric connections to coils, e.g. leads
H01R 12/77 2011.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
12Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards (PCBs), flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
70Coupling devices
77for flexible printed circuits, flat or ribbon cables or like structures
H05K 1/18 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
CPC
H01F 5/04
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
5Coils
04Arrangements of electric connections to coils, e.g. leads
H05K 1/18
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
Applicants
  • HUTCHINSON TECHNOLOGY INCORPORATED [US]/[US]
Inventors
  • SCHUMANN, John L.
  • GERMAN, Nole D.
  • JOHNSON, Trent A.
  • JELKIN, Duane M.
  • LANG, Matthew S.
  • RUZICKA, Ryan N.
  • CRAVENS, Forrest A.
  • PETER, Todd A.
  • POKORNOWSKI, Zachary A.
Agents
  • MOONEY, Christopher M.
Priority Data
16/693,12522.11.2019US
62/774,02730.11.2018US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) HIGH DENSITY COIL DESIGN AND PROCESS
(FR) CONCEPTION DE BOBINE À HAUTE DENSITÉ ET PROCÉDÉ
Abstract
(EN)
Devices including a substrate and a plurality of coil portions disposed on the substrate. The plurality of coil portions electrically coupled to form a coil structure.
(FR)
L'invention concerne des dispositifs comprenant un substrat et une pluralité de parties de bobine disposées sur le substrat. Les bobines de la pluralité de parties de bobine sont couplées électriquement pour former une structure de bobine.
Also published as
Latest bibliographic data on file with the International Bureau