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1. WO2020112490 - INTEGRATED CIRCUIT PACKAGE INCLUDING INWARD BENT LEADS

Publication Number WO/2020/112490
Publication Date 04.06.2020
International Application No. PCT/US2019/062633
International Filing Date 21.11.2019
IPC
H01L 21/52 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
52Mounting semiconductor bodies in containers
H01L 23/047 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
04characterised by the shape
043the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
047the other leads being parallel to the base
CPC
H01L 21/4842
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
4814Conductive parts
4821Flat leads, e.g. lead frames with or without insulating supports
4842Mechanical treatment, e.g. punching, cutting, deforming, cold welding
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48247
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48245the item being metallic
48247connecting the wire to a bond pad of the item
H01L 23/49503
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
488consisting of soldered ; or bonded; constructions
495Lead-frames ; or other flat leads
49503characterised by the die pad
H01L 23/49548
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
488consisting of soldered ; or bonded; constructions
495Lead-frames ; or other flat leads
49541Geometry of the lead-frame
49548Cross section geometry
H01L 23/49551
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
488consisting of soldered ; or bonded; constructions
495Lead-frames ; or other flat leads
49541Geometry of the lead-frame
49548Cross section geometry
49551characterised by bent parts
Applicants
  • TEXAS INSTRUMENTS INCORPORATED [US]/[US]
  • TEXAS INSTRUMENTS JAPAN LIMITED [JP]/[JP] (JP)
Inventors
  • MEYERS, Michael, L.
  • EISENHART, Scott, F.
  • SAYE, Richard, J.
  • KODURI, Sreenivasan, K.
Agents
  • ABRAHAM, Ebby
Common Representative
  • TEXAS INSTRUMENTS INCORPORATED
Priority Data
16/202,80828.11.2018US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) INTEGRATED CIRCUIT PACKAGE INCLUDING INWARD BENT LEADS
(FR) BOÎTIER DE CIRCUITS INTÉGRÉS COMPRENANT DES CONDUCTEURS INCURVÉS VERS L'INTÉRIEUR
Abstract
(EN)
A packaged semiconductor device (100) includes a semiconductor die (180) mounted on a leadframe, a housing (120) for the semiconductor die defining a horizontal plane and a horizontal direction. The leadframe includes leads (102, 103, 108, 109) each having an inner lead portion inside the housing and an outer lead portion that includes a first portion (102a, 103a, 108a, 109a) that extends out in the horizontal direction from one of the sidewalls (120c, 120d) of the housing, a transition portion (102b, 103b, 108b, 109b) that includes a vertical direction component, and a distal end portion (102c, 103c, 108c, 109c), wherein the distal end portion of the leads are all on the horizontal plane. The outer lead portions alternate between a gull wing lead shape (103, 109) having the distal end portions extending in the horizontal direction outward from the housing and inward extending leads (102, 108) that have their distal end portions extending in the horizontal direction inward toward the housing. The leadframe consists of a single leadframe.
(FR)
L'invention concerne un dispositif à semi-conducteur sous boîtier (100) comprenant une puce semi-conductrice (180) montée sur une grille de connexion, un boîtier (120) de la puce semi-conductrice définissant un plan horizontal et une direction horizontale. La grille de connexion comprend des conducteurs (102, 103, 108, 109) comportant individuellement une partie de conducteur interne à l'intérieur du boîtier et une partie de conducteur externe qui comprend une première partie (102a, 103a, 108a, 109a) s'étendant dans la direction horizontale à partir de l'une des parois latérales (120c, 120d) du boîtier, une partie de transition (102b, 103b, 108b, 109b) comprenant une composante de direction verticale, et une partie d'extrémité distale (102c, 103c, 108c, 109c), toutes les parties d'extrémité distale des conducteurs se trouvant sur le plan horizontal. Les parties de conducteur externe alternent entre une forme de conducteur en aile en M (103, 109) dont les parties d'extrémité distale s'étendent dans la direction horizontale vers l'extérieur du boîtier et des conducteurs s'étendant vers l'intérieur (102, 108) dont les parties d'extrémité distale s'étendent dans la direction horizontale vers l'intérieur en direction du boîtier. La grille de connexion est constituée d'une seule grille de connexion.
Also published as
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