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1. WO2020112481 - APPARATUS AND METHOD FOR IMPEDANCE BALANCING OF LONG RADIO FREQUENCY (RF) VIA

Publication Number WO/2020/112481
Publication Date 04.06.2020
International Application No. PCT/US2019/062570
International Filing Date 21.11.2019
IPC
H03H 7/38 2006.01
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
7Multiple-port networks comprising only passive electrical elements as network components
38Impedance-matching networks
H05K 1/11 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
H05K 1/16 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
16incorporating printed electric components, e.g. printed resistor, capacitor, inductor
CPC
H03H 7/38
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
7Multiple-port networks comprising only passive electrical elements as network components
38Impedance-matching networks
H05K 1/0251
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0213Electrical arrangements not otherwise provided for
0237High frequency adaptations
025Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
0251related to vias or transitions between vias and transmission lines
H05K 1/0298
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
0298Multilayer circuits
H05K 2201/09563
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
095Conductive through-holes or vias
09563Metal filled via
H05K 2201/09618
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
095Conductive through-holes or vias
09618Via fence, i.e. one-dimensional array of vias
H05K 2201/09636
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
095Conductive through-holes or vias
09636Details of adjacent, not connected vias
Applicants
  • LOCKHEED MARTIN CORPORATION [US]/[US]
Inventors
  • ZAMARRON, Jesse Michael
Agents
  • SANKS, Terry M.
  • WOLTER, Robert, L.
  • BEUSSE, James, H.
  • MAIRE, David, G.
  • VANDYKE, Timothy, H.
Priority Data
62/772,82429.11.2018US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) APPARATUS AND METHOD FOR IMPEDANCE BALANCING OF LONG RADIO FREQUENCY (RF) VIA
(FR) APPAREIL ET PROCÉDÉ D'ÉQUILIBRAGE D'IMPÉDANCE D'UN TROU D'INTERCONNEXION RADIOFRÉQUENCE (RF) LONG
Abstract
(EN)
An apparatus comprising a stack of printed circuit board (PCB) layers having a primary longitudinal structure forming a radio frequency (RE) via including a principal tuning section (223) and a constant longitudinal structure (227) along a conductive column support (255) journaled through the layers in the via. The principal section (221) comprising a first tuning sub-assembly (229 A) in a first portion of the RE via above the longitudinal structure (227) and at an entrance of the primary longitudinal structure (221) and comprising a first set of pad, anti-pad pairs (445, 545, 645) tuned to receive an RE band. A second principal tuning sub-assembly (229B) in a second portion of the via below the longitudinal structure (227) and at an exit of the primary longitudinal structure and comprising a second set of pad, anti-pad pairs (445, 545, 645) tuned to receive the band and mirroring the first set of pairs.
(FR)
Un appareil comprend un empilement de couches de carte de circuit imprimé (PCB) ayant une structure longitudinale primaire formant un trou d'interconnexion fréquence radio (RE) comprenant une section d'accord principale (223) et une structure longitudinale constante (227) le long d'un support de colonne conducteur (255) tourillonné à travers les couches dans le trou d'interconnexion. La section principale (221) comprend un premier sous-ensemble d'accord (229 A) dans une première partie du trou d'interconnexion RE au-dessus de la structure longitudinale (227) et à une entrée de la structure longitudinale primaire (221) et comprenant un premier ensemble de paires de pastilles, et de paires pastilles non métallisées (445, 545, 645) réglées pour recevoir une bande de RE. Un second sous-ensemble d'accord principal (229B) dans une seconde partie du trou d'interconnexion au-dessous de la structure longitudinale (227) et à une sortie de la structure longitudinale primaire et comprenant un second ensemble de paires de pastilles, et de pastilles non métallisées (445, 545, 645) réglées pour recevoir la bande et dupliquer le premier ensemble de paires.
Latest bibliographic data on file with the International Bureau