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1. WO2020112311 - LOW COST METHOD FOR DEPOSITING SOLDER OR ADHESIVE IN A PATTERN FOR FORMING ELECTRONIC ASSEMBLIES

Publication Number WO/2020/112311
Publication Date 04.06.2020
International Application No. PCT/US2019/059789
International Filing Date 05.11.2019
IPC
H05K 3/12 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
12using printing techniques to apply the conductive material
H01L 23/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
H05K 3/34 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
34by soldering
CPC
B23K 1/0016
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1Soldering, e.g. brazing, or unsoldering
0008specially adapted for particular articles or work
0016Brazing of electronic components
B23K 2101/42
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2101Articles made by soldering, welding or cutting
36Electric or electronic devices
42Printed circuits
B23K 3/0638
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
3Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
06Solder feeding devices; Solder melting pans
0607Solder feeding devices
0638for viscous material feeding, e.g. solder paste feeding
B23K 37/06
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
37Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
06for positioning the molten material, e.g. confining it to a desired area
H01L 21/4853
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
4814Conductive parts
4846Leads on or in insulating or insulated substrates, e.g. metallisation
4853Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
H01L 23/49816
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
49811Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
49816Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
Applicants
  • RAYTHEON COMPANY [US]/[US]
Inventors
  • MARTINEZ, Sergio V.
  • OGORZALEK, Jeffrey R.
  • LOTT, Patrick J.
Agents
  • LAWRENCE, M. Brad
Priority Data
16/203,81529.11.2018US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) LOW COST METHOD FOR DEPOSITING SOLDER OR ADHESIVE IN A PATTERN FOR FORMING ELECTRONIC ASSEMBLIES
(FR) PROCÉDÉ À FAIBLE COÛT DE DÉPOSITION DE BRASURE OU D'ADHÉSIF DANS UN MOTIF POUR FORMER DES ENSEMBLES ÉLECTRONIQUES
Abstract
(EN)
A method (400) for depositing a material (106) to join two surfaces of an electronic assembly includes determining, using dimensions of a pad area (102) of a substrate (100), a deposition pattern for the material that extends across the pad area of the substrate. The method further includes creating a tool (200) to deposit the material in the deposition pattern that extends across the pad area of the substrate.
(FR)
Procédé (400) de dépôt d'un matériau (106) pour joindre deux surfaces d'un ensemble électronique consistant à déterminer, à l'aide des dimensions d'une zone de pastille (102) d'un substrat (100), un motif de dépôt pour le matériau qui s'étend à travers la zone de tampon du substrat. Le procédé comprend en outre la création d'un outil (200) de dépôt de matériau dans le motif de dépôt qui s'étend à travers la zone de tampon du substrat.
Also published as
Latest bibliographic data on file with the International Bureau