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1. WO2020111767 - METHOD FOR MANUFACTURING FCCL CAPABLE OF CONTROLLING FLEXIBILITY AND STIFFNESS OF CONDUCTIVE PATTERN

Publication Number WO/2020/111767
Publication Date 04.06.2020
International Application No. PCT/KR2019/016455
International Filing Date 27.11.2019
IPC
H05K 3/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
02in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
H05K 1/09 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
09Use of materials for the metallic pattern
H05K 3/18 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
18using precipitation techniques to apply the conductive material
CPC
H05K 1/09
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
09Use of materials for the ; conductive, e.g. ; metallic pattern
H05K 3/02
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
02in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
H05K 3/18
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
18using precipitation techniques to apply the conductive material
Applicants
  • 삼원액트 주식회사 SAMWON ACT CO., LTD. [KR]/[KR]
Inventors
  • 이경열 LEE, Kyung Yul
  • 최광종 CHOI, Kwang Jong
  • 이평우 LEE, Pyoung Woo
  • 백두열 BAEK, Doo Yul
Agents
  • 조현석 CHO, Hyeon Seog
Priority Data
10-2018-015102829.11.2018KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) METHOD FOR MANUFACTURING FCCL CAPABLE OF CONTROLLING FLEXIBILITY AND STIFFNESS OF CONDUCTIVE PATTERN
(FR) PROCÉDÉ DE FABRICATION DE STRATIFIÉ CUIVRÉ FLEXIBLE CAPABLE DE CONTRÔLER LA FLEXIBILITÉ ET LA RIGIDITÉ D'UN TRACÉ CONDUCTEUR
(KO) 도전 패턴의 연성 및 강성 조절이 가능한 FCCL 제조 방법
Abstract
(EN)
Disclosed is a method for manufacturing an FCCL capable of controlling flexibility and stiffness of a conductive pattern. One embodiment of the method for manufacturing the FCCL includes: an electroforming step for forming, by electroforming, a conductive pattern on a mold for electroforming; and a transferring step for transferring the conductive pattern from the mold for electroforming to the lower portion of the polymer plastic film, wherein the electroforming step is performed in a plating tank equipped with a first metal, a second metal, and a third metal, wherein the first metal is copper, and the second metal is, for adding flexibility, one of tin (Sn), gold (Au), silver (Ag), or aluminum (Al), and the third metal is, for adding stiffness, one of nickel (Ni), cobalt (Co), chromium (Cr), iron (Fe), tungsten (W), or titanium (Ti).
(FR)
L'invention concerne un procédé de fabrication d'un stratifié cuivré flexible capable de contrôler la flexibilité et la rigidité d'un tracé conducteur. Un mode de réalisation du procédé de fabrication du stratifié cuivré flexible comprend : une étape d'électroformage consistant à former, par électroformage, un tracé conducteur sur un moule d'électroformage; et une étape de transfert consistant à transférer le tracé conducteur du moule d'électroformage à la partie inférieure du film plastique polymère, l'étape d'électroformage étant réalisée dans une cuve de galvanisation équipée d'un premier métal, d'un deuxième métal et d'un troisième métal, le premier métal étant du cuivre, et le deuxième métal étant l'un parmi l'étain (Sn), l'or (Au), l'argent (Ag), ou l'aluminium (Al), pour ajouter de la flexibilité, et le troisième métal étant l'un parmi le nickel (Ni), le cobalt (Co), le chrome (Cr), le fer (Fe), le tungstène (W), ou le titane (Ti), pour ajouter de la rigidité.
(KO)
도전 패턴의 연성 및 강성 조절이 가능한 FCCL 제조 방법이 개시된다. FCCL 제조 방법의 일 실시예는 전주 도금에 의해 전주도금용 몰드 상에 도전 패턴을 형성하는 전주 도금 과정; 및 상기 전주도금용 몰드로부터 폴리머 플라스틱 필름의 하부로 상기 도전 패턴을 전사하는 전사 과정; 을 포함하며, 여기서, 상기 전주 도금 과정은 제1금속, 제2금속 그리고 제3금속이 구비된 도금조에서 수행되며, 여기서, 상기 제1금속은 구리이고, 상기 제2금속은 연성을 부가하기 위한 것으로서, 주석(Sn), 금(Au), 은(Ag), 알루미늄(Al) 중의 하나이고, 상기 제3금속은 강성을 부가하기 위한 것으로서, 니켈(Ni), 코발트(Co), 크롬(Cr), 철(Fe), 텅스텐(W), 티타늄(Ti) 중의 하나인 것을 특징으로 한다.
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