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1. WO2020111690 - MULTI-PROBER CHUCK ASSEMBLY AND CHANNEL

Publication Number WO/2020/111690
Publication Date 04.06.2020
International Application No. PCT/KR2019/016249
International Filing Date 25.11.2019
IPC
G01R 31/28 2006.01
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
G01R 1/073 2006.01
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types covered by groups G01R5/-G01R13/122
02General constructional details
06Measuring leads; Measuring probes
067Measuring probes
073Multiple probes
H01L 21/683 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
CPC
G01R 1/073
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
02General constructional details
06Measuring leads; Measuring probes
067Measuring probes
073Multiple probes
G01R 31/28
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
H01L 21/683
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
Applicants
  • 한국생산기술연구원 KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY [KR]/[KR]
Inventors
  • 남경태 NAM, Kyung Tae
  • 이승준 LEE, Seung Joon
  • 이광희 LEE, Kwang Hee
Agents
  • 특허법인 이룸리온 ERUUM & LEEON INTELLECTUAL PROPERTY LAW FIRM
Priority Data
10-2018-014965928.11.2018KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) MULTI-PROBER CHUCK ASSEMBLY AND CHANNEL
(FR) ENSEMBLE MANDRIN MULTI-SONDE ET CANAL
(KO) 멀티 프로버용 척 조립체 및 채널
Abstract
(EN)
A multi-prober chuck assembly and channel are provided. The multi-prober chuck assembly, according to one embodiment of the present invention, comprises: a chuck for supporting a wafer; a probe card structure coupled to the top part of the chuck; a heater for heating the chuck from the bottom part of the chuck; a conductive guard plate spaced apart from the heater at the bottom part of the heater; and a body part positioned on the bottom part of the chuck so that the heater and the guard plate are positioned inside the body part, wherein the multi-prober chuck assembly has a cartridge-type structure by means of the probe card structure and the body part being mechanically coupled.
(FR)
L'invention concerne un ensemble mandrin multi-sonde et un canal. L'ensemble mandrin multi-sonde, selon un mode de réalisation de la présente invention, comprend : un mandrin permettant de supporter une tranche ; une structure de carte sonde accouplée à la partie supérieure du mandrin ; un dispositif chauffant permettant de chauffer le mandrin depuis la partie inférieure du mandrin ; une plaque de protection conductrice espacée du dispositif chauffant au niveau de la partie inférieure du dispositif chauffant ; et une partie corps positionnée sur la partie inférieure du mandrin de sorte que le dispositif chauffant et la plaque de protection soient positionnés à l'intérieur de la partie corps, l'ensemble mandrin multi-sonde possédant une structure de type cartouche au moyen de l'accouplement mécanique de la structure de carte sonde et de la partie corps.
(KO)
멀티 프로버용 척 조립체 및 채널이 제공된다. 본 발명의 일 실시예에 따른 멀티 프로버용 척 조립체는 웨이퍼를 지지하는 척; 척 상부에 결합되는 프로프 카드 구조체; 척 하부에서 척을 히팅하는 히터; 히터의 하부에 히터로부터 이격 배치되는 도전성 가드판 및, 히터 및 가드판이 내부에 위치되도록 척 하부에 위치되는 몸체부를 포함하며, 프로프 카드 구조체 및 몸체부가 기계적으로 결합되어 카트리지형 구조를 갖도록 형성된다.
Also published as
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