Processing

Please wait...

Settings

Settings

Goto Application

1. WO2020111669 - DEVICE FOR CLEANING SURFACE BY USING ELECTROWETTING ELEMENT AND METHOD FOR CONTROLLING SAME

Publication Number WO/2020/111669
Publication Date 04.06.2020
International Application No. PCT/KR2019/016129
International Filing Date 22.11.2019
IPC
H01L 21/67 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/02 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
CPC
H01L 21/02
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/67
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
Applicants
  • 엘지전자 주식회사 LG ELECTRONICS INC. [KR]/[KR]
Inventors
  • 김원수 KIM, Wonsu
  • 지석만 JI, Salkmann
  • 오상훈 OH, Sanghoon
  • 홍삼열 HONG, Samnyol
Agents
  • 특허법인(유한)케이비케이 KBK & ASSOCIATES
Priority Data
62/771,17926.11.2018US
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) DEVICE FOR CLEANING SURFACE BY USING ELECTROWETTING ELEMENT AND METHOD FOR CONTROLLING SAME
(FR) DISPOSITIF DE NETTOYAGE DE SURFACE À L'AIDE D'UN ÉLÉMENT D'ÉLECTROMOUILLAGE ET SON PROCÉDÉ DE COMMANDE
(KO) 전기습윤소자를 이용한 표면세정장치 및 이의 제어방법
Abstract
(EN)
The present application provides a device for effectively removing alien substances from the surface of an object and a method for controlling same. The present application may provide an object surface cleaning device comprising: a substrate provided on the surface of a predetermined object; an electrode provided on the substrate and comprising first and second electrodes disposed in different planes, respectively; a dielectric layer provided on the substrate and configured to cover the electrode; and a control device configured to supply AC power to the electrode. The control device may be configured to provide the electrode with first AC power having a predetermined first frequency and a predetermined first voltage for one hour, in order to cause droplets on the surface of the object to vibrate by means of a periodic change in electrostatic force produced by the electrode. The first frequency may be configured as the resonant frequency of the droplets.
(FR)
La présente invention porte sur un dispositif destiné à éliminer efficacement des substances étrangères de la surface d'un objet, et sur son procédé de commande. La présente invention peut permettre d'obtenir un dispositif de nettoyage de surface d'objet comprenant : un substrat placé sur la surface d'un objet prédéterminé ; une électrode placée sur le substrat et comprenant des première et seconde électrodes disposées dans des plans différents, respectivement ; une couche diélectrique placée sur le substrat et configurée pour couvrir l'électrode ; et un dispositif de commande configuré pour fournir de la puissance en courant alternatif (CA) à l'électrode. Le dispositif de commande peut être configuré pour fournir à l'électrode une première puissance CA ayant une première fréquence prédéterminée et une première tension prédéterminée pendant une heure, afin de faire vibrer des gouttelettes présentes sur la surface de l'objet au moyen d'une variation périodique de la force électrostatique engendrée par l'électrode. La première fréquence peut être configurée à la fréquence de résonance des gouttelettes.
(KO)
본 출원은 물체표면상의 이물질을 효과적으로 제거하는 장치 및 이의 제어방법을 개시한다. 본 출원은 소정 물체의 표면상에 제공되는 기판; 상기 기판에 제공되며, 서로 다른 평면들내에 각각 배치되는 제 1 및 제 2 전극들을 포함하는 전극; 상기 기판에 제공되며, 상기 전극을 덮도록 구성되는 절연층(dielectric layer); 및 상기 전극에 교류전원을 공급하도록 구성되는 제어장치를 포함하며, 상기 제어장치는 상기 전극에서 발생되는 정전기력의 주기적인 변화에 의해 상기 물체표면상의 액적에 진동을 발생시키기 위해, 소정의 제 1 주파수 및 소정의 제 1 전압을 갖는 제 1 교류전원을 제 1 시간동안 상기 전극에 제공하도록 구성되며, 상기 제 1 주파수는 상기 액적의 공진주파수로 설정되는 물체표면 세정장치를 제공할 수 있다.
Latest bibliographic data on file with the International Bureau