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1. WO2020111588 - MEMS ELEMENT HAVING CURVED REFLECTIVE LAYER AND METHOD FOR MANUFACTURING MEMS DEVICE

Publication Number WO/2020/111588
Publication Date 04.06.2020
International Application No. PCT/KR2019/015379
International Filing Date 13.11.2019
IPC
B81B 7/02 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems
02containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems (MEMS)
B81C 1/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
CPC
B81B 7/02
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems; ; Auxiliary parts of microstructural devices or systems
02containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
B81C 1/00
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
Applicants
  • 한국과학기술원 KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY [KR]/[KR]
Inventors
  • 이종권 LEE, Jong-Kwon
  • 오재섭 OH, Jae-Sub
  • 박종철 PARK, Jongcheol
Agents
  • 특허법인 누리 NURY PATENT LAW FIRM
Priority Data
10-2018-014908528.11.2018KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) MEMS ELEMENT HAVING CURVED REFLECTIVE LAYER AND METHOD FOR MANUFACTURING MEMS DEVICE
(FR) ÉLÉMENT MEMS AYANT UNE COUCHE RÉFLÉCHISSANTE INCURVÉE ET PROCÉDÉ DE FABRICATION DE DISPOSITIF MEMS
(KO) 곡면 반사층을 가지는 멤스 소자 및 멤스 디바이스의 제조 방법
Abstract
(EN)
A MEMS element according to an embodiment of the present invention comprises: a lower substrate; an infrared sensor formed on the lower substrate; and a lower bonding pad disposed to cover the infrared sensor. The infrared sensor comprises: a metal pad formed on the upper surface of the lower substrate and electrically connected to a detection circuit; a reflective layer formed on the upper surface of the lower substrate and reflecting an infrared band; an absorption plate spaced apart from the upper portion of the reflective layer and absorbing infrared rays to change resistance; and an anchor formed on the metal pad to support the absorption plate and electrically connect the metal pad and the absorption plate. The reflective layer has a curved or stepped shape such that the distance between the reflective layer and the absorption plate varies depending on the position of the reflective layer.
(FR)
Selon un mode de réalisation de la présente invention, un élément MEMS comprend : un substrat inférieur ; un capteur infrarouge formé sur le substrat inférieur ; et un plot de connexion inférieur disposé pour recouvrir le capteur infrarouge. Le capteur infrarouge comprend : un plot métallique formé sur la surface supérieure du substrat inférieur et connecté électriquement à un circuit de détection ; une couche réfléchissante formée sur la surface supérieure du substrat inférieur et réfléchissant une bande infrarouge ; une plaque d'absorption espacée de la partie supérieure de la couche réfléchissante et absorbant les rayons infrarouges pour changer de résistance ; et un ancrage formé sur le plot métallique pour supporter la plaque d'absorption et connecter électriquement le plot métallique et la plaque d'absorption. La couche réfléchissante a une forme incurvée ou étagée de telle sorte que la distance entre la couche réfléchissante et la plaque d'absorption varie en fonction de la position de la couche réfléchissante
(KO)
본 발명의 일 실시예에 따른 멤스 소자는, 하부 기판; 상기 하부 기판에 형성된 적외선 센서; 및 상기 적외선 센서를 감싸도록 배치된 하부 본딩 패드;를 포함한다. 상기 적외선 센서는, 상기 하부 기판의 상부면에 형성되어 검출회로와 전기적으로 연결되는 금속 패드; 상기 하부 기판의 상부면에 형성되고 적외선 대역을 반사하는 반사층; 상기 반사층의 상부에 이격되어 형성되고 적외선을 흡수하여 저항을 변화시키는 흡수판; 및 상기 금속 패드의 상부에 형성되어 상기 흡수판을 지지하고 상기 금속 패드와 상기 흡수판을 전기적으로 연결하는 앵커를 포함한다. 상기 반사층은 상기 반사층과 상기 흡수판 사이의 거리가 상기 반사층의 위치에 따라 다르도록 곡면 또는 계단 형태를 가진다.
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