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1. WO2020111582 - TRANSPARENT DISPLAY UNIT AND GLASS ASSEMBLY COMPRISING THE SAME

Publication Number WO/2020/111582
Publication Date 04.06.2020
International Application No. PCT/KR2019/015356
International Filing Date 12.11.2019
IPC
H01L 27/15 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
15including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
H01L 27/12 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
H05K 3/32 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
H01L 33/40 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
36characterised by the electrodes
40Materials therefor
H01L 33/56 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
56Materials, e.g. epoxy or silicone resin
CPC
H01L 27/12
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
H01L 27/15
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
15including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
H01L 33/40
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
36characterised by the electrodes
40Materials therefor
H01L 33/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
56Materials, e.g. epoxy or silicone resin
H05K 3/32
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
Applicants
  • HANKUK GLASS INDUSTRIES INC. [KR]/[KR]
Inventors
  • KIM, Kangmin
Agents
  • YOU ME PATENT AND LAW FIRM
Priority Data
10-2018-014839927.11.2018KR
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) TRANSPARENT DISPLAY UNIT AND GLASS ASSEMBLY COMPRISING THE SAME
(FR) UNITÉ D'AFFICHAGE TRANSPARENT ET ENSEMBLE VERRE LE COMPRENANT
Abstract
(EN)
A transparent display unit according to an exemplary embodiment of the present invention includes: a transparent substrate film; an edge electrode layer disposed on the upper surface of the transparent substrate film; an anisotropically conductive adhesive layer disposed on the edge electrode layer; and a flexible printed circuit board (FPCB) disposed on the anisotropically conductive adhesive layer and electrically connected to the edge electrode layer through the anisotropically conductive adhesive layer, wherein the flexible printed circuit board (FPCB) includes an electrode portion and a resin layer, and the resin layer extends from the edge portion of the anisotropically conductive adhesive layer to be in contact with the edge electrode layer.
(FR)
Une unité d'affichage transparente selon un mode de réalisation donné à titre d'exemple de la présente invention comprend : un film de substrat transparent; une couche d'électrode de bord disposée sur la surface supérieure du film de substrat transparent; une couche adhésive conductrice anisotrope disposée sur la couche d'électrode de bord; et une carte de circuit imprimé souple (FPCB) disposée sur la couche adhésive conductrice anisotrope et connectée électriquement à la couche d'électrode de bord par l'intermédiaire de la couche adhésive conductrice anisotrope, la carte de circuit imprimé souple (FPCB) comprend une partie d'électrode et une couche de résine, et la couche de résine s'étend à partir de la partie de bord de la couche adhésive conductrice anisotrope pour être en contact avec la couche d'électrode de bord.
Also published as
Latest bibliographic data on file with the International Bureau