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1. WO2020111522 - PHOTOSENSITIVE RESIN COMPOSITION, FILM, AND ELECTRONIC DEVICE

Publication Number WO/2020/111522
Publication Date 04.06.2020
International Application No. PCT/KR2019/014103
International Filing Date 24.10.2019
IPC
G03F 7/037 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
032with binders
037the binders being polyamides or polyimides
G03F 7/033 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
032with binders
033the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
G03F 7/038 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
038Macromolecular compounds which are rendered insoluble or differentially wettable
CPC
G03F 7/033
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
032with binders
033the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
G03F 7/037
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
032with binders
037the binders being polyamides or polyimides
G03F 7/038
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
038Macromolecular compounds which are rendered insoluble or differentially wettable
Applicants
  • (주)덕산테코피아 DUKSAN TECHOPIA CO. LTD. [KR]/[KR]
Inventors
  • 이대원 LEE, Dae Won
  • 유충열 YOO, Chung Youl
  • 허선희 HEO, Sun Hee
  • 조용정 JO, Yong Jeong
  • 김준환 KIM, Jun Hwan
  • 안상엽 AHN, Sang Yeob
  • 이슬기 LEE, Seul Ki
  • 김준기 KIM, Jun Ki
  • 배준 BAE, Jun
Agents
  • 특허법인(유한)유일하이스트 YUIL HIGHEST INTERNATIONAL PATENT AND LAW FIRM
Priority Data
10-2018-015006328.11.2018KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) PHOTOSENSITIVE RESIN COMPOSITION, FILM, AND ELECTRONIC DEVICE
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE, FILM ET DISPOSITIF ÉLECTRONIQUE
(KO) 감광성 수지 조성물, 필름 및 전자장치
Abstract
(EN)
The present invention may provide: a photosensitive resin composition which is capable of high resolution patterning at low light intensity, is excellent in pattern adhesion, is capable of fine patterning, and is excellent in cured film properties; a film; and an electronic device.
(FR)
La présente invention peut fournir : une composition de résine photosensible qui est capable de former un motif à haute résolution à une faible intensité de lumière, qui est excellente en termes d'adhérence de motif, qui est capable de former des motifs fins et qui présente d'excellentes propriétés de film durci; un film; et un dispositif électronique.
(KO)
본 발명은 저광량에서 고해상도 패터닝이 가능하고, 패턴 밀착성이 우수하며, 미세한 패터닝이 가능하며, 경화막 특성이 우수한 감광성 수지 조성물, 필름 및 전자장치를 제공할 수 있다.
Also published as
Latest bibliographic data on file with the International Bureau