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1. WO2020111400 - POLYIMIDE FILM COMPRISING AT LEAST TWO FILLERS HAVING DIFFERENT DIAMETERS, AND ELECTRONIC DEVICE COMPRISING SAME

Publication Number WO/2020/111400
Publication Date 04.06.2020
International Application No. PCT/KR2019/003492
International Filing Date 26.03.2019
IPC
C08J 5/18 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5Manufacture of articles or shaped materials containing macromolecular substances
18Manufacture of films or sheets
C08L 79/08 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08L61/-C08L77/259
04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C08G 73/10 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C08K 3/013 2018.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
01characterised by their specific function
013Fillers, pigments or reinforcing additives
C08K 3/36 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
34Silicon-containing compounds
36Silica
C08K 7/18 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
7Use of ingredients characterised by shape
16Solid spheres
18inorganic
CPC
C08G 73/10
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
73Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C08J 5/18
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G
5Manufacture of articles or shaped materials containing macromolecular substances
18Manufacture of films or sheets
C08K 3/013
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
01characterized by their specific function
013Fillers, pigments or reinforcing additives
C08K 3/36
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
34Silicon-containing compounds
36Silica
C08K 7/18
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
7Use of ingredients characterised by shape
16Solid spheres
18inorganic
C08L 79/08
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Applicants
  • 피아이첨단소재 주식회사 PI ADVANCED MATERIALS CO., LTD. [KR]/[KR]
Inventors
  • 원동영 WON, Dong Young
  • 김동영 KIM, Dong Young
  • 최정열 CHOI, Jeong Yeul
Agents
  • 특허법인 아주 AJU INTERNATIONAL LAW & PATENT GROUP
Priority Data
10-2018-015203730.11.2018KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) POLYIMIDE FILM COMPRISING AT LEAST TWO FILLERS HAVING DIFFERENT DIAMETERS, AND ELECTRONIC DEVICE COMPRISING SAME
(FR) FILM DE POLYIMIDE COMPRENANT AU MOINS DEUX CHARGES AYANT DES DIAMÈTRES DIFFÉRENTS ET DISPOSITIF ÉLECTRONIQUE LE COMPORTANT
(KO) 입경이 상이한 2 이상의 필러를 포함하는 폴리이미드 필름 및 이를 포함하는 전자장치
Abstract
(EN)
The present invention provides a polyimide film comprising an inorganic filler, which comprises a first filler group having a diameter (D50) of 2-2.7 μm and a second filler group having an average diameter (D50) of 1-1.7 μm, wherein the polyimide film satisfies relation 1: 0.7 ≤ (D90-D10)/(D50) ≤ 1.2, which is about the respective diameters of the first filler group and the second filler group.
(FR)
La présente invention concerne un film de polyimide comprenant une charge inorganique, qui comprend un premier groupe de charges ayant un diamètre (D50) de 2 à 2,7 µm et un second groupe de charges ayant un diamètre moyen (D50) de 1 à 1,7 µm, le film de polyimide satisfaisant à la relation 1 : 0,7 ≤ (D90-D10)/(D50) ≤ 1,2, qui porte approximativement sur les diamètres respectifs du premier groupe de charges et du second groupe de charges.
(KO)
본 발명은 입경(D50)이 2 ㎛ 내지 2.7 ㎛의 범위에 속하는 제1 필러군 및 평균 입경(D50)이 1 ㎛ 내지 1.7 ㎛의 범위에 속하는 제2 필러군을 포함하는 무기계 필러를 포함하며, 제1 필러군 및 제2 필러군 각각 입경에 대한 관계식 1: 0.7 ≤ (D90-D10)/(D50) ≤ 1.2를 만족하는 폴리이미드 필름을 제공한다.
Also published as
Latest bibliographic data on file with the International Bureau