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1. WO2020111273 - LEAD-FREE SOLDER ALLOY

Publication Number WO/2020/111273
Publication Date 04.06.2020
International Application No. PCT/JP2019/046910
International Filing Date 29.11.2019
IPC
C22C 13/00 2006.01
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
13Alloys based on tin
B23K 35/26 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22characterised by the composition or nature of the material
24Selection of soldering or welding materials proper
26with the principal constituent melting at less than 400°C
CPC
B23K 35/26
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22characterised by the composition or nature of the material
24Selection of soldering or welding materials proper
26with the principal constituent melting at less than 400 degrees C
C22C 13/00
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
13Alloys based on tin
Applicants
  • 株式会社日本スペリア社 NIHON SUPERIOR CO., LTD. [JP]/[JP]
Inventors
  • 西村 貴利 NISHIMURA Takatoshi
  • 西村 哲郎 NISHIMURA Tetsuro
  • 赤岩 徹哉 AKAIWA Tetsuya
Agents
  • 柳野 隆生 YANAGINO Takao
  • 柳野 嘉秀 YANAGINO Yoshihide
  • 森岡 則夫 MORIOKA Norio
  • 関口 久由 SEKIGUCHI Hisayoshi
  • 中川 正人 NAKAGAWA Masato
Priority Data
2018-22541630.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) LEAD-FREE SOLDER ALLOY
(FR) ALLIAGE DE SOUDAGE SANS PLOMB
(JA) 鉛フリーはんだ合金
Abstract
(EN)
In the present invention, corrosion of a nozzle used in a spot solder bath, for instance, can be inhibited by a lead-free solder alloy containing 0.3 to 4.0 mass% of Ag, 0.1 to 2.0 mass% of Cu, 0.005 to 0.05 mass% of Fe, 0.01 to 0.5 mass% of Ni, 0.001 to 0.1 mass% of Ga and Sn as the balance.
(FR)
Dans la présente invention, la corrosion d'une buse utilisée dans un bain de soudage par points, par exemple, peut être inhibée par un alliage de soudage sans plomb contenant 0,3 à 4,0 % en masse d’Ag, 0,1 à 2,0 % en masse de Cu, 0,005 à 0,05 % en masse de Fe, 0,01 à 0,5 % en masse de Ni, 0,001 à 0,1 % en masse de Ga et du Sn en tant que complément.
(JA)
Agを0.3~4.0質量%、Cuを0.1~2.0質量%、Feを0.005~0.05質量%、Niを0.01~0.5質量%、Gaを0.001~0.1質量%含み、残部がSnである鉛フリーはんだ合金により、例えばスポットはんだ槽等に用いられているノズルの腐食を抑制することができる。
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