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1. WO2020111258 - VIRTUAL MEASUREMENT DEVICE, VIRTUAL MEASUREMENT METHOD, AND VIRTUAL MEASUREMENT PROGRAM

Publication Number WO/2020/111258
Publication Date 04.06.2020
International Application No. PCT/JP2019/046869
International Filing Date 29.11.2019
IPC
H01L 21/02 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/66 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66Testing or measuring during manufacture or treatment
G05B 19/418 2006.01
GPHYSICS
05CONTROLLING; REGULATING
BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
19Programme-control systems
02electric
418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control (DNC), flexible manufacturing systems (FMS), integrated manufacturing systems (IMS), computer integrated manufacturing (CIM)
CPC
G05B 19/418
GPHYSICS
05CONTROLLING; REGULATING
BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
19Programme-control systems
02electric
418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
H01L 21/02
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
Applicants
  • 東京エレクトロン株式会社 TOKYO ELECTRON LIMITED [JP]/[JP]
Inventors
  • 筒井 拓郎 TSUTSUI, Takuro
Agents
  • 伊東 忠重 ITOH, Tadashige
  • 伊東 忠彦 ITOH, Tadahiko
Priority Data
2018-22567630.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) VIRTUAL MEASUREMENT DEVICE, VIRTUAL MEASUREMENT METHOD, AND VIRTUAL MEASUREMENT PROGRAM
(FR) DISPOSITIF, PROCÉDÉ ET PROGRAMME DE MESURE VIRTUELLE
(JA) 仮想測定装置、仮想測定方法及び仮想測定プログラム
Abstract
(EN)
Provided are a virtual measurement device, a virtual measurement method, and a virtual measurement program enabling a highly accurate virtual measurement process. The virtual measurement device has: an acquisition unit for acquiring a chronological data group measured in the processing of an object, in a predetermined processing unit in a manufacturing process; and a learning unit for machine-learning a plurality of network units so that the result of combining output data outputted by processing the acquired chronological data group using the plurality of network units approaches inspection data for the result of processing the object in the predetermined processing unit in the manufacturing process.
(FR)
L'invention concerne un dispositif, un procédé et un programme de mesure virtuelle permettant un processus de mesure virtuelle très précis. Le dispositif de mesure virtuelle comprend : une unité d'acquisition destinée à acquérir un groupe de données chronologiques mesuré lors du traitement d'un objet, dans une unité de traitement prédéfinie dans un processus de fabrication ; et une unité d'apprentissage destinée à apprendre par machine une pluralité d'unités de réseau de sorte que le résultat de la combinaison de données de sortie produites par le biais du traitement du groupe de données chronologiques acquis à l'aide de la pluralité d'unités de réseau soit proche de données d'inspection concernant le résultat de traitement de l'objet dans l'unité de traitement prédéfinie dans le processus de fabrication.
(JA)
高精度な仮想測定処理を実行可能な仮想測定装置、仮想測定方法及び仮想測定プログラムを提供する。仮想測定装置は、製造プロセスの所定の処理単位において、対象物の処理に伴い測定された時系列データ群を取得する取得部と、取得した前記時系列データ群を複数のネットワーク部を用いて処理することで出力された各出力データの合成結果が、前記製造プロセスの前記所定の処理単位において前記対象物を処理した際の結果物の検査データに近づくよう、前記複数のネットワーク部を機械学習する学習部とを有する。
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