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1. WO2020111244 - UNDERFILL MATERIAL, SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE

Publication Number WO/2020/111244
Publication Date 04.06.2020
International Application No. PCT/JP2019/046826
International Filing Date 29.11.2019
IPC
H01L 23/29 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
29characterised by the material
H01L 23/31 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
31characterised by the arrangement
C08L 63/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63Compositions of epoxy resins; Compositions of derivatives of epoxy resins
H01L 21/60 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
CPC
C08L 63/00
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63Compositions of epoxy resins; Compositions of derivatives of epoxy resins
H01L 23/29
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
29characterised by the material ; , e.g. carbon
H01L 23/31
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
31characterised by the arrangement ; or shape
Applicants
  • 日立化成株式会社 HITACHI CHEMICAL COMPANY, LTD. [JP]/[JP]
Inventors
  • 関 皓平 SEKI, Kohei
  • 堀 浩士 HORI, Kohji
  • 平井 友貴 HIRAI, Tomoki
Agents
  • 特許業務法人太陽国際特許事務所 TAIYO, NAKAJIMA & KATO
Priority Data
2018-22459630.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) UNDERFILL MATERIAL, SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
(FR) MATÉRIAU DE REMPLISSAGE SOUS-JACENT, BOÎTIER DE SEMI-CONDUCTEUR ET PROCÉDÉ DE PRODUCTION DE BOÎTIER DE SEMI-CONDUCTEUR
(JA) アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法
Abstract
(EN)
This underfill material contains an epoxy resin and a rubber component; and the epoxy resin contains an epoxy compound that has two epoxy groups in each molecule, but does not contain a ring structure other than the epoxy groups, while having a molecular weight of 650 or less.
(FR)
L'invention concerne un matériau de remplissage sous-jacent contenant une résine époxy et un composant de caoutchouc ; et la résine époxy contient un composé époxy qui a deux groupes époxy dans chaque molécule, mais ne contient pas de structure cyclique autre que les groupes époxy, tout en ayant un poids moléculaire inférieur ou égal à 650.
(JA)
アンダーフィル材は、エポキシ樹脂と、ゴム成分と、を含み、前記エポキシ樹脂が、1分子中に2つのエポキシ基を有し、分子量が650以下であり、かつ前記エポキシ基以外の環構造を含まないエポキシ化合物を含む。
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