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1. WO2020111107 - BONDED BODY, HEAT SINK-ATTACHED INSULATED CIRCUIT BOARD, AND HEAT SINK

Publication Number WO/2020/111107
Publication Date 04.06.2020
International Application No. PCT/JP2019/046332
International Filing Date 27.11.2019
IPC
B23K 20/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
20Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
C22C 21/00 2006.01
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
21Alloys based on aluminium
H01L 23/36 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H01L 23/40 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
40Mountings or securing means for detachable cooling or heating arrangements
CPC
B23K 20/00
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
20Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
C22C 21/00
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
21Alloys based on aluminium
H01L 23/36
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
H01L 23/40
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
40Mountings or securing means for detachable cooling or heating arrangements
Applicants
  • 三菱マテリアル株式会社 MITSUBISHI MATERIALS CORPORATION [JP]/[JP]
Inventors
  • 寺▲崎▼ 伸幸 TERASAKI Nobuyuki
Agents
  • 松沼 泰史 MATSUNUMA Yasushi
  • 寺本 光生 TERAMOTO Mitsuo
  • 細川 文広 HOSOKAWA Fumihiro
  • 大浪 一徳 ONAMI Kazunori
Priority Data
2018-22234728.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) BONDED BODY, HEAT SINK-ATTACHED INSULATED CIRCUIT BOARD, AND HEAT SINK
(FR) CORPS LIÉ, CARTE Å CIRCUIT IMPRIMÉ ISOLÉE, FIXÉE À UN DISSIPATEUR THERMIQUE, ET DISSIPATEUR THERMIQUE
(JA) 接合体、ヒートシンク付絶縁回路基板、及び、ヒートシンク
Abstract
(EN)
Provided is a bonded body in which an aluminum alloy member formed of an aluminum alloy is solid-phase diffusion bonded with a copper member formed of copper or a copper alloy, and which has an excellent thermal cycle reliability, excellent heat dissipation characteristics, and excellent strength. The bonded body includes an aluminum alloy member (31) bonded with a copper member (13B), wherein the aluminum alloy member (31) has an Si concentration in the range of 1.5-12.5 mass%, an Fe concentration of not more than 0.15 mass%, and a Cu concentration of not more than 0.05 mass%. The aluminum alloy member (31) and the copper member (13B) are solid-phase diffusion bonded, and the ratio t2/t1 is in the range of 1.2-2.0 where t1 is the thickness of a first intermetallic compound layer (41) including a θ phase and disposed on the side of the aluminum alloy member (31), and t2 is the thickness of a second intermetallic compound layer (42) including a non-θ phase other than the θ phase and disposed on the side of the copper member (13B).
(FR)
L'invention concerne un corps lié dans lequel un élément en alliage d'aluminium formé d'un alliage d'aluminium est lié par diffusion en phase solide avec un élément en cuivre formé de cuivre ou d'un alliage de cuivre, et qui possède une excellente fiabilité de cycle thermique, d'excellentes caractéristiques de dissipation de chaleur et une excellente résistance. Le corps lié comprend un élément en alliage d'aluminium (31) lié à un élément en cuivre (13B), l'élément en alliage d'aluminium (31) possédant une concentration en Si dans la plage de 1,5-12,5 % een masse, une concentration en Fe inférieure ou égale à 0,15 % en masse, et une concentration en Cu inférieure ou égale à 0,05 % en masse. L'élément en alliage d'aluminium (31) et l'élément en cuivre (13B) sont liés par diffusion en phase solide, et le rapport t2/t1 se situe dans la plage de 1,2 à 2,0, t1 représentant l'épaisseur d'une première couche de composé intermétallique (41) qui comprend une phase thêta et est disposée sur le côté de l'élément en alliage d'aluminium (31), et t2 représentant l'épaisseur d'une seconde couche de composé intermétallique (42) qui comprend une phase non-thêta autre que la phase thêta et est disposée sur le côté de l'élément en cuivre (13B).
(JA)
アルミニウム合金からなるアルミニウム合金部材と、銅又は銅合金からなる銅部材と、が固相拡散接合されてなり、冷熱サイクル信頼性に優れ、かつ、放熱特性及び強度に優れた接合体を提供する。銅部材(13B)とアルミニウム合金部材(31)とが接合されてなる接合体であって、アルミニウム合金部材(31)は、Si濃度が1.5mass%以上12.5mass%以下の範囲内、Fe濃度が0.15mass%以下、Cuの濃度が0.05mass%以下とされ、アルミニウム合金部材(31)と銅部材(13B)とが固相拡散接合されており、アルミニウム合金部材(31)側に位置するとともにθ相からなる第1金属間化合物層(41)の厚さt1と、銅部材(13B)側に位置するとともにθ相以外の非θ相からなる第2金属間化合物層(42)の厚さt2との比t2/t1が1.2以上2.0以下の範囲内とされている。
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