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1. WO2020111022 - ETHYLENIC UNSATURATED RESIN COMPOSITION AND PHOTOSENSITIVE RESIN COMPOSITION

Publication Number WO/2020/111022
Publication Date 04.06.2020
International Application No. PCT/JP2019/046060
International Filing Date 26.11.2019
IPC
C08F 290/12 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
290Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
08on to polymers modified by introduction of unsaturated side groups
12Polymers provided for in subclasses C08C or C08F76
G03F 7/004 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
G03F 7/027 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
G03F 7/038 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
038Macromolecular compounds which are rendered insoluble or differentially wettable
CPC
C08F 290/12
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
290Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
08on to polymers modified by introduction of unsaturated side groups
12Polymers provided for in subclasses C08C or C08F
G03F 7/004
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
G03F 7/027
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
G03F 7/038
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
038Macromolecular compounds which are rendered insoluble or differentially wettable
Applicants
  • 昭和電工株式会社 SHOWA DENKO K.K. [JP]/[JP]
Inventors
  • 柳 正義 YANAGI Masayoshi
  • 川口 恭章 KAWAGUCHI Yasuaki
  • 氣賀澤 杏 KEGASAWA An
Agents
  • 及川 周 OIKAWA Shu
  • 荒 則彦 ARA Norihiko
  • 勝俣 智夫 KATSUMATA Tomoo
Priority Data
2018-22273028.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ETHYLENIC UNSATURATED RESIN COMPOSITION AND PHOTOSENSITIVE RESIN COMPOSITION
(FR) COMPOSITION DE RÉSINE ÉTHYLÉNIQUEMENT INSATURÉE ET COMPOSITION DE RÉSINE PHOTOSENSIBLE
(JA) エチレン性不飽和樹脂組成物、及び感光性樹脂組成物
Abstract
(EN)
Provided is a resin composition having a low residual amount of polymerization inhibitor, and having high transparency, thermal yellowing resistance, and dispersibility of fine particles, including coloring materials. This ethylenic unsaturated resin composition contains an ethylenic unsaturated resin (A), carbon clusters (c), and a solvent (B). The carbon clusters (c) are fullerene and/or a soot-like substance, and the carbon cluster (c) content is 0.00001-10 parts by mass per 100 parts by mass of the ethylenic unsaturated resin (A).
(FR)
L'invention concerne une composition de résine présentant une faible quantité résiduelle d'inhibiteur de polymérisation et présentant une transparence élevée, une résistance élevée au jaunissement thermique et une dispersibilité élevée de particules fines, y compris des matières colorantes. Cette composition de résine éthyléniquement insaturée contient une résine éthyléniquement insaturée (A), des agrégats de carbone (c) et un solvant (B). Les agrégats de carbone (c) sont des fullerènes et/ou une substance de type suie et la teneur en agrégats de carbone (c) est de 0,00001-10 parties en masse pour 100 parties en masse de la résine éthyléniquement insaturée (A).
(JA)
残存重合禁止剤量が少なく、透明性、耐熱黄変性、色材を含む微粒子分散性が高い樹脂組成物が提供される。本発明のエチレン性不飽和樹脂組成物は、エチレン性不飽和樹脂(A)と、炭素クラスター(c)と、溶剤(B)とを含有し、前記炭素クラスター(c)は、フラーレンおよびすす状物質のうちの少なくとも1つであり、その含有量は、前記エチレン性不飽和樹脂(A)100質量部に対して0.00001~10質量部である。
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