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1. WO2020111015 - METHOD FOR JOINING TRANSPARENT SUBSTRATES, AND LAMINATED BODY

Publication Number WO/2020/111015
Publication Date 04.06.2020
International Application No. PCT/JP2019/046041
International Filing Date 25.11.2019
IPC
H05B 33/04 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
02Details
04Sealing arrangements
H05B 33/10 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
H01L 51/50 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
C23C 14/08 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
06characterised by the coating material
08Oxides
CPC
C23C 14/08
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
06characterised by the coating material
08Oxides
H01L 51/50
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
H05B 33/04
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
02Details
04Sealing arrangements ; , e.g. against humidity
H05B 33/10
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
Applicants
  • ランテクニカルサービス株式会社 LAN TECHNICAL SERVICE CO., LTD. [JP]/[JP]
  • 須賀 唯知 SUGA Tadatomo [JP]/[JP]
Inventors
  • 須賀 唯知 SUGA Tadatomo
  • 松本 好家 MATSUMOTO Yoshiie
Agents
  • 赤津 豪 AKATSU Takeshi
Priority Data
2018-21983826.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) METHOD FOR JOINING TRANSPARENT SUBSTRATES, AND LAMINATED BODY
(FR) PROCÉDÉ DE JONCTION DE SUBSTRATS TRANSPARENTS, ET CORPS STRATIFIÉ
(JA) 透明基板の接合方法及び積層体
Abstract
(EN)
Provided is a method for joining transparent substrates, the method comprising: preparing a pair of transparent substrates; forming aluminum oxide thin films on joint surfaces of the transparent substrates by sputtering; joining the pair of transparent substrates by bringing the aluminum oxide thin films into contact with air; and heating the pair of joined transparent substrates.
(FR)
L'invention concerne un procédé de jonction de substrats transparents, le procédé consistant à : préparer une paire de substrats transparents; former par pulvérisation des films minces d'oxyde d'aluminium sur des surfaces de jonction des substrats transparents; joindre la paire de substrats transparents en amenant les films minces d'oxyde d'aluminium en contact avec l'air; et chauffer la paire de substrats transparents joints.
(JA)
透明基板の接合法であって、1対の透明基板を用意することと、透明基板の接合面に、スパッタリング法により酸化アルミニウムの薄膜を形成することと、酸化アルミニウムの薄膜を大気中で接触させて前記1対の透明基板を接合することと、接合された1対の透明基板を加熱することとを備える。
Also published as
Latest bibliographic data on file with the International Bureau