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1. WO2020110988 - AQUEOUS ADHESIVE

Publication Number WO/2020/110988
Publication Date 04.06.2020
International Application No. PCT/JP2019/045940
International Filing Date 25.11.2019
IPC
C09J 105/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
105Adhesives based on polysaccharides or on their derivatives, not provided for in groups C09J101/ or C09J103/147
C08K 5/053 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
04Oxygen-containing compounds
05Alcohols; Metal alcoholates
053Polyhydroxylic alcohols
CPC
C08K 5/053
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
04Oxygen-containing compounds
05Alcohols; Metal alcoholates
053Polyhydroxylic alcohols
C09J 105/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
105Adhesives based on polysaccharides or on their derivatives, not provided for in groups C09J101/00 or C09J103/00
Applicants
  • HENKEL AG & CO. KGAA [DE]/[DE]
Inventors
  • TAMOGAMI, Tsuyoshi
  • YOSHIDA, Yoshio
  • HAYAKAWA, Tadashi
Agents
  • YAMAO, Norihito
  • MORIZUMI, Ken-Ichi
Priority Data
2018-22149627.11.2018JP
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) AQUEOUS ADHESIVE
(FR) ADHÉSIF AQUEUX
Abstract
(EN)
Disclosed is an aqueous adhesive comprising a saccharide and a polyalcohol having a boiling point of 200 to 285°C, wherein the polyalcohol is comprised in an amount of 5.0 to 30.0 parts by weight (in terms of solid content) based on 100 parts by weight (in terms of solid content) of the total weight of the saccharide and the polyalcohol. The aqueous adhesive can contribute to efficient production of a molded material. Mechanical properties such as shear strength, tensile strength, and tensile elastic modulus of the molded material can be improved.
(FR)
L'invention concerne un adhésif aqueux comprenant un saccharide et un polyalcool présentant un point d'ébullition de 200 à 285 °C, le polyalcool étant compris dans une quantité de 5,0 à 30,0 parties en poids (en termes de teneur en solides) sur la base de 100 parties en poids (en termes de teneur en solides) du poids total du saccharide et du polyalcool. L'adhésif aqueux peut contribuer à la production efficace d'un matériau moulé. Des propriétés mécaniques telles que la résistance au cisaillement, la résistance à la traction et le module d'élasticité en traction du matériau moulé peuvent être améliorées.
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