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1. WO2020110973 - HEAT SINK

Publication Number WO/2020/110973
Publication Date 04.06.2020
International Application No. PCT/JP2019/045900
International Filing Date 25.11.2019
IPC
F28D 15/02 2006.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEAT STORAGE PLANTS OR APPARATUS IN GENERAL
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls
02in which the medium condenses and evaporates, e.g. heat-pipes
F28D 15/04 2006.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEAT STORAGE PLANTS OR APPARATUS IN GENERAL
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls
02in which the medium condenses and evaporates, e.g. heat-pipes
04with tubes having a capillary structure
H01L 23/36 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H01L 23/427 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
42Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
427Cooling by change of state, e.g. use of heat pipes
H05K 7/20 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
CPC
F28D 15/0266
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
02in which the medium condenses and evaporates, e.g. heat pipes
0266with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
F28D 15/04
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
02in which the medium condenses and evaporates, e.g. heat pipes
04with tubes having a capillary structure
F28F 1/26
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
1Tubular elements; Assemblies of tubular elements
10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
12the means being only outside the tubular element
24and extending transversely
26the means being integral with the element
H01L 23/427
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
42Fillings or auxiliary members in containers ; or encapsulations; selected or arranged to facilitate heating or cooling
427Cooling by change of state, e.g. use of heat pipes
H05K 7/20336
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
2029using a liquid coolant with phase change in electronic enclosures
20336Heat pipes, e.g. wicks or capillary pumps
Applicants
  • 古河電気工業株式会社 FURUKAWA ELECTRIC CO., LTD. [JP]/[JP]
Inventors
  • 渡邉 陽介 WATANABE Yosuke
  • 三浦 達朗 MIURA Tatsuro
  • 中村 敏明 NAKAMURA Toshiaki
  • 川畑 賢也 KAWABATA Kenya
  • 稲垣 義勝 INAGAKI Yoshikatsu
Agents
  • アインゼル・フェリックス=ラインハルト EINSEL Felix-Reinhard
  • 前川 純一 MAEKAWA Junichi
  • 二宮 浩康 NINOMIYA Hiroyasu
  • 上島 類 UESHIMA Rui
  • 住吉 秀一 SUMIYOSHI Shuichi
Priority Data
2018-22603430.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) HEAT SINK
(FR) DISSIPATEUR THERMIQUE
(JA) ヒートシンク
Abstract
(EN)
The present invention provides a heat sink in which the cooling efficiency of heat-dissipating fins is improved irrespective of the orientation in which the heat sink is installed, the heat sink being capable of demonstrating exceptional cooling performance with respect to an object to be cooled, and being installable even in a cramped space. This heat sink comprises: a heat transport member having a heat-receiving part that is thermally connected to a heat-emitting body, the heat transport member being provided with a first wick structure; a pipe body connected to a heat-insulating part or a heat-dissipating part of the heat transport member, the pipe body being provided with a second wick structure; and a heat-dissipating fin group that is thermally connected to the pipe body, the heat-dissipating fin group being such that a plurality of heat-dissipating fins are arranged. The heat transport member has an internal space that communicates from the heat-receiving part to a connection part with the pipe body, the internal space being a single space in which a working fluid is sealed. The internal space in the heat transport member communicates with an internal space in the pipe body. The first wick structure has a divergence part that diverges in the thickness direction of the heat transport member, and a multi-stage branch part that extends in a prescribed direction from the divergence part.
(FR)
La présente invention concerne un dissipateur thermique dans lequel l'efficacité de refroidissement des ailettes de dissipation de chaleur est améliorée quelle que soit l'orientation dans laquelle le dissipateur thermique est installé, le dissipateur thermique étant capable de démontrer une performance de refroidissement exceptionnelle vis-à-vis d'un objet à refroidir, et pouvant être installé même dans un espace exigu. Le présent dissipateur thermique comprend : un élément de transport de chaleur ayant une partie de réception de chaleur qui est reliée thermiquement à un corps d'émission de chaleur, l'élément de transport de chaleur étant pourvu d'une première structure de mèche ; un corps de tuyau relié à une partie d'isolation thermique ou à une partie de dissipation de chaleur de l'élément de transport de chaleur, le corps de tuyau étant pourvu d'une seconde structure de mèche ; et un groupe d'ailettes de dissipation de chaleur qui est relié thermiquement au corps de tuyau, le groupe d'ailettes de dissipation de chaleur étant tel qu'une pluralité d'ailettes de dissipation de chaleur sont agencées. L'élément de transport de chaleur a un espace interne qui communique de la partie de réception de chaleur jusqu'à une partie de raccordement avec le corps de tuyau, l'espace interne étant un espace unique dans lequel un fluide de travail est scellé. L'espace interne dans l'élément de transport de chaleur communique avec un espace interne dans le corps de tuyau. La première structure de mèche a une partie de divergence qui diverge dans la direction de l'épaisseur de l'élément de transport de chaleur, et une partie de ramification à plusieurs étages qui s'étend dans une direction prescrite à partir de la partie de divergence.
(JA)
本発明は、ヒートシンクの設置姿勢に関わらず、放熱フィンの冷却効率が向上して、冷却対象に対して優れた冷却性能を発揮でき、また、狭い空間でも設置可能なヒートシンクを提供する。 発熱体と熱的に接続される受熱部を有する、第1のウィック構造体を備えた熱輸送部材と、該熱輸送部材の断熱部または放熱部にて接続された、第2のウィック構造体を備えた管体と、該管体と熱的に接続された、複数の放熱フィンが配置された放熱フィン群と、を備え、前記熱輸送部材が、前記受熱部から前記管体との接続部まで連通し、且つ作動流体が封入された一体である内部空間を有し、前記熱輸送部材の内部空間が、前記管体の内部空間と連通し、前記第1のウィック構造体が、前記熱輸送部材の厚さ方向に分岐した分岐部と該分岐部から所定方向へ伸延する多段の枝部を有するヒートシンク。
Also published as
EP2019856492
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