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1. WO2020110947 - POLYIMIDE RESIN, POLYIMIDE VARNISH AND POLYIMIDE FILM

Publication Number WO/2020/110947
Publication Date 04.06.2020
International Application No. PCT/JP2019/045814
International Filing Date 22.11.2019
IPC
C08G 73/10 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
CPC
C08G 73/10
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
73Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Applicants
  • 三菱瓦斯化学株式会社 MITSUBISHI GAS CHEMICAL COMPANY, INC. [JP]/[JP]
Inventors
  • 安孫子 洋平 ABIKO, Yohei
  • 星野 舜 HOSHINO, Shun
  • 村谷 孝博 MURAYA, Takahiro
  • 関口 慎司 SEKIGUCHI, Shinji
  • 高田 貴文 TAKADA, Takafumi
Agents
  • 平澤 賢一 HIRASAWA, Kenichi
Priority Data
2018-22289428.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) POLYIMIDE RESIN, POLYIMIDE VARNISH AND POLYIMIDE FILM
(FR) RÉSINE DE POLYIMIDE, VERNIS DE POLYIMIDE ET FILM DE POLYIMIDE
(JA) ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム
Abstract
(EN)
Provided is a polyimide resin having constituent units A derived from tetracarboxylic dianhydride and constituent units B derived from diamine. The constituent units A include constituent units (A-1) derived from a compound represented by formula (a-1), and constituent units (A-2) derived from a compound represented by formula (a-2). Constituent units B include constituent units (B-1) derived from a compound represented by formula (b-1), and the ratio of constituent units (B-1) in constituent unit B is at least 70 mol%. Also provided are a polyimide varnish and a polyimide film containing said polyimide resin.
(FR)
L'invention concerne une résine de polyimide comprenant des motifs constitutifs A dérivés d'un dianhydride d'acide tétracarboxylique et des motifs constitutifs B dérivés d'une diamine. Les motifs constitutifs A comprennent des motifs constitutifs (A-1) dérivés d'un composé représenté par la formule (a-1), et des motifs constitutifs (A-2) dérivés d'un composé représenté par la formule (a-2). Les motifs constitutifs B comprennent des motifs constitutifs (B-1) dérivés d'un composé représenté par la formule (b-1), et le rapport des motifs constitutifs (B-1) dans le motif constitutif B est d'au moins 70 % en moles. L'invention concerne également un vernis de polyimide et un film de polyimide contenant ladite résine de polyimide.
(JA)
テトラカルボン酸二無水物に由来する構成単位A及びジアミンに由来する構成単位Bを有するポリイミド樹脂であって、構成単位Aが下記式(a-1)で表される化合物に由来する構成単位(A-1)と、下記式(a-2)で表される化合物に由来する構成単位(A-2)とを含み、構成単位Bが下記式(b-1)で表される化合物に由来する構成単位(B-1)を含み、構成単位B中における構成単位(B-1)の比率が70モル%以上である、ポリイミド樹脂、並びに該ポリイミド樹脂を含むポリイミドワニス及びポリイミドフィルム。
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