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1. WO2020110939 - RESIN COMPOSITION AND PRODUCTION METHOD THEREFOR

Publication Number WO/2020/110939
Publication Date 04.06.2020
International Application No. PCT/JP2019/045797
International Filing Date 22.11.2019
IPC
C08G 59/42 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40characterised by the curing agents used
42Polycarboxylic acids; Anhydrides, halides, or low-molecular-weight esters thereof
H01L 23/29 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
29characterised by the material
H01L 23/31 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
31characterised by the arrangement
C08K 5/3445 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
16Nitrogen-containing compounds
34Heterocyclic compounds having nitrogen in the ring
3442having two nitrogen atoms in the ring
3445Five-membered rings
C08K 5/524 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
49Phosphorus-containing compounds
51Phosphorus bound to oxygen
52bound to oxygen only
524Esters of phosphorous acids, e.g. of H3PO3
C08L 63/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63Compositions of epoxy resins; Compositions of derivatives of epoxy resins
CPC
C08G 59/24
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; ; e.g. general methods of curing
20characterised by the epoxy compounds used
22Di-epoxy compounds
24carbocyclic
C08G 59/42
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; ; e.g. general methods of curing
40characterised by the curing agents used
42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
C08K 3/013
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
01characterized by their specific function
013Fillers, pigments or reinforcing additives
C08K 3/20
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
18Oxygen-containing compounds, e.g. metal carbonyls
20Oxides; Hydroxides
C08K 5/3445
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
16Nitrogen-containing compounds
34Heterocyclic compounds having nitrogen in the ring
3442having two nitrogen atoms in the ring
3445Five-membered rings
C08K 5/524
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
49Phosphorus-containing compounds
51Phosphorus bound to oxygen
52Phosphorus bound to oxygen only
524Esters of phosphorous acids, e.g. of H3PO3
Applicants
  • 株式会社ダイセル DAICEL CORPORATION [JP]/[JP]
  • エスモ マテリアルズ カンパニー・リミテッド ESMO MATERIALS CO., LTD. [KR]/[KR]
Inventors
  • 平川裕之 HIRAKAWA, Hiroyuki
  • 山本康雄 YAMAMOTO, Yasuo
  • 趙誠雨 CHO, Sung-Woo
Agents
  • 特許業務法人後藤特許事務所 GOTO & CO.
Priority Data
2018-22416329.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) RESIN COMPOSITION AND PRODUCTION METHOD THEREFOR
(FR) COMPOSITION DE RÉSINE ET SON PROCÉDÉ DE PRODUCTION
(JA) 樹脂組成物、及びその製造方法
Abstract
(EN)
Provided is a resin composition which can be efficiently produced at low cost in a short time period. The resin composition of the present invention comprises: a semi-cured object (1) obtained from a polyfunctional epoxy compound (A) which includes an alicycle including an epoxy group configured of an oxygen atom and two adjoining carbon atoms as components of the alicycle or which includes an alicycle having an epoxy group bonded thereto by a single bond and a carboxylic anhydride (B) having an alicyclic skeleton; a semi-cured object (2) obtained from a polyhydric alcohol (C) and a carboxylic anhydride (B) having an alicyclic skeleton; an imidazole compound (D); a compound (E) represented by formula (e) (wherein R’ represents a hydrocarbon group and s is an integer of 1-3); and an inorganic oxide (F) having hydroxyl groups on the surface. The resin composition is solid at ordinary temperature. (e): P(OH)s(OR’)3-s
(FR)
L'invention concerne une composition de résine qui peut être produite efficacement à faible coût en un court laps de temps. La composition de résine de la présente invention comprend : un objet semi-durci (1) obtenu à partir d'un composé époxyde polyfonctionnel (A) qui comprend un alicycle comprenant un groupe époxy constitué d'un atome d'oxygène et de deux atomes de carbone adjacents en tant que constituants de l'alicycle ou qui comprend un alicycle auquel est lié un groupe époxy par une liaison simple et d'un anhydride carboxylique (B) présentant un squelette alicyclique ; un objet semi-durci (2) obtenu à partir d'un alcool polyhydrique (C) et d'un anhydride carboxylique (B) présentant un squelette alicyclique ; d'un composé imidazole (D) ; d'un composé (E) représenté par la formule (dans laquelle R' représente un groupe hydrocarboné et s est un nombre entier de 1 à 3) ; et d'un oxyde inorganique (F) ayant des groupes hydroxyle sur la surface. La composition de résine est solide à température ordinaire. (e) : P(OH)s(OR')3-s
(JA)
低コスト、且つ、短時間で効率よく製造することができる樹脂組成物を提供する。 本発明の樹脂組成物は、脂環を構成する隣接する2つの炭素原子と酸素原子とで構成されるエポキシ基、又は脂環と単結合により結合するエポキシ基を有する多官能エポキシ化合物(A)と脂環骨格を有するカルボン酸無水物(B)との半硬化物(1)、多価アルコール(C)と脂環骨格を有するカルボン酸無水物(B)との半硬化物(2)、イミダゾール化合物(D)、下記式(e) P(OH)s(OR')3-s (e) (式中、R’は炭化水素基を示し、sは1~3の整数を示す) で表される化合物(E)、及び表面に水酸基を有する無機酸化物(F)を含み、常温において固体である。
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