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1. WO2020110867 - ELECTRIC ELEMENT-MOUNTING ARRAY PACKAGE AND ELECTRIC DEVICE

Publication Number WO/2020/110867
Publication Date 04.06.2020
International Application No. PCT/JP2019/045514
International Filing Date 20.11.2019
IPC
H01L 33/48 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
H01L 33/62 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
62Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H01L 33/64 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
64Heat extraction or cooling elements
H01S 5/022 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
022Mountings; Housings
CPC
H01L 33/48
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
H01L 33/62
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
H01L 33/64
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
64Heat extraction or cooling elements
H01S 5/022
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
022Mountings; Housings
Applicants
  • 京セラ株式会社 KYOCERA CORPORATION [JP]/[JP]
Inventors
  • 古久保 洋二 FURUKUBO, Youji
  • 東 登志文 HIGASHI, Toshifumi
  • 山口 貴史 YAMAGUCHI, Takafumi
Agents
  • 特許業務法人酒井国際特許事務所 SAKAI INTERNATIONAL PATENT OFFICE
Priority Data
2018-22054526.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ELECTRIC ELEMENT-MOUNTING ARRAY PACKAGE AND ELECTRIC DEVICE
(FR) BOÎTIER DE RÉSEAU DE MONTAGE D'ÉLÉMENTS ÉLECTRIQUES ET DISPOSITIF ÉLECTRIQUE
(JA) 電気素子搭載用アレイパッケージおよび電気装置
Abstract
(EN)
Provided is an electric element-mounting array package in which a plurality of electric element-mounting packages each having an electric element-mounting surface (13) are arrayed, wherein the height of the mounting surface (13) of at least one electric element-mounting package differs from the height of the mounting surface (13) of another electric element-mounting package. The electric element-mounting array package also comprises a recess (12) which opens on an upper surface (11) and has the mounting surface (13) in a bottom portion thereof.
(FR)
L'invention concerne un boîtier de réseau de montage d'éléments électriques dans lequel une pluralité de boîtiers de montage d'éléments électriques présentant chacun une surface de montage d'éléments électriques (13) sont disposés en réseau, la hauteur de la surface de montage (13) d'au moins un boîtier de montage d'éléments électriques étant différente de la hauteur de la surface de montage (13) d'un autre boîtier de montage d'éléments électriques. Le boîtier de réseau de montage d'éléments électriques comprend également un évidement (12) qui s'ouvre sur une surface supérieure (11), et la surface de montage (13) se situe dans sa partie inférieure.
(JA)
電気素子搭載用アレイパッケージは、電気素子の搭載面(13)を有する電気素子搭載用パッケージが複数並んで設けられ、少なくとも1つの電気素子搭載用パッケージの搭載面(13)の高さが、他の電気素子搭載用パッケージの搭載面(13)の高さと異なる。また、電気素子搭載用アレイパッケージは、かかるおもて面(11)に開口し、搭載面(13)を底部に備えた凹部(12)を有する。
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