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1. WO2020110859 - CURABLE RESIN COMPOSITION, CURED PRODUCT AND ORGANIC EL DISPLAY ELEMENT

Publication Number WO/2020/110859
Publication Date 04.06.2020
International Application No. PCT/JP2019/045421
International Filing Date 20.11.2019
IPC
C08G 59/68 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
68characterised by the catalysts used
C08G 65/18 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
65Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
02from cyclic ethers by opening of the heterocyclic ring
04from cyclic ethers only
06Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
16Cyclic ethers having four or more ring atoms
18Oxetanes
H05B 33/04 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
02Details
04Sealing arrangements
H01L 51/50 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
H01L 27/32 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
CPC
C08G 59/68
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; ; e.g. general methods of curing
68characterised by the catalysts used
C08G 65/18
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
65Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
02from cyclic ethers by opening of the heterocyclic ring
04from cyclic ethers only
06Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
16Cyclic ethers having four or more ring atoms
18Oxetanes
H01L 27/32
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
H01L 51/50
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
H05B 33/04
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
02Details
04Sealing arrangements ; , e.g. against humidity
Applicants
  • 積水化学工業株式会社 SEKISUI CHEMICAL CO., LTD. [JP]/[JP]
Inventors
  • 西海 由季 NISHIUMI, Yuki
  • 山本 拓也 YAMAMOTO, Takuya
  • 増井 良平 MASUI, Ryohei
  • 金 千鶴 KIM, Chizuru
  • 笹野 美香 SASANO, Mika
Agents
  • 特許業務法人 安富国際特許事務所 YASUTOMI & ASSOCIATES
Priority Data
2018-22273528.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CURABLE RESIN COMPOSITION, CURED PRODUCT AND ORGANIC EL DISPLAY ELEMENT
(FR) COMPOSITION DE RÉSINE DURCISSABLE, PRODUIT DURCI, ET ÉLÉMENT D'AFFICHAGE ÉLECTROLUMINESCENT ORGANIQUE
(JA) 硬化性樹脂組成物、硬化物、及び、有機EL表示素子
Abstract
(EN)
The purpose of the present invention is to provide a curable resin composition which can be stably coated over a long period of time using an inkjet method and which can give an organic EL display element having excellent reliability. The purpose of the present invention is also to provide a cured product of the curable resin composition; and an organic EL display element having the cured product. The present invention is a curable resin composition which can be used for sealing an organic EL display element and which contains a polymerizable compound and a photopolymerization initiator. In differential scanning calorimetric measurements based on JIS K 7122 after storing the curable resin composition for 5 days at 60ºC, the peak temperature is 120°C or higher for all exothermic peaks for which the peak height is 0.05 mW/mg or more and the calorific value is 10 mJ/mg or more.
(FR)
Le but de la présente invention est de fournir une composition de résine durcissable qui peut être revêtue de façon stable sur une longue durée à l'aide d'un procédé à jet d'encre et qui peut donner un élément d'affichage électroluminescent organique ayant une excellente fiabilité. L'objectif de la présente invention est également de fournir un produit durci de la composition de résine durcissable ; et un élément d'affichage électroluminescent organique comprenant le produit durci. La présente invention concerne une composition de résine durcissable qui peut être utilisée pour sceller un élément d'affichage électroluminescent organique et qui contient un composé polymérisable et un initiateur de photopolymérisation. Dans des mesures calorimétriques de balayage différentiel basées sur JIS K 7122 après stockage de la composition de résine durcissable pendant 5 jours à 60 °C, la température de pic est de 120 °C ou plus pour tous les pics exothermiques pour lesquels la hauteur de pic est de 0,05 mW/mg ou plus et la valeur calorifique est de 10 mJ/mg ou plus.
(JA)
本発明は、インクジェット法により長期間安定して塗布することができ、信頼性に優れる有機EL表示素子を得ることができる硬化性樹脂組成物を提供することを目的とする。また、本発明は、該硬化性樹脂組成物の硬化物、及び、該硬化物を有する有機EL表示素子を提供することを目的とする。 本発明は、有機EL表示素子の封止に用いられる硬化性樹脂組成物であって、重合性化合物と光重合開始剤とを含有し、60℃で5日間保管した後のJIS K 7122に基づいた示差走査熱量測定において、ピーク高さ0.05mW/mg以上、及び、発熱量10mJ/mg以上を満たす全ての発熱ピークのピーク温度が120℃以上である硬化性樹脂組成物である。
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