Processing

Please wait...

Settings

Settings

Goto Application

1. WO2020110809 - LASER PROCESSING METHOD AND LASER PROCESSING MACHINE

Publication Number WO/2020/110809
Publication Date 04.06.2020
International Application No. PCT/JP2019/045123
International Filing Date 18.11.2019
IPC
B23K 26/067 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06Shaping the laser beam, e.g. by masks or multi-focusing
067Dividing the beam into multiple beams, e.g. multi-focusing
B23K 26/388 2014.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
38by boring or cutting
382by boring
388Trepanning, i.e. boring by moving the beam spot about an axis
CPC
B23K 26/067
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06Shaping the laser beam, e.g. by masks or multi-focusing
067Dividing the beam into multiple beams, e.g. multifocusing
B23K 26/08
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
08Devices involving relative movement between laser beam and workpiece
B23K 26/382
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
38by boring or cutting
382by boring
B23K 26/386
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
38by boring or cutting
382by boring
386of blind holes
B23K 26/388
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
38by boring or cutting
382by boring
388Trepanning, i.e. boring by moving the beam spot about an axis
Applicants
  • デクセリアルズ株式会社 DEXERIALS CORPORATION [JP]/[JP]
Inventors
  • 柴田 章広 SHIBATA Akihiro
  • 小田桐 広和 ODAGIRI Hirokazu
  • 土井 克浩 DOI Katsuhiro
Agents
  • 杉村 憲司 SUGIMURA Kenji
Priority Data
2018-22409129.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) LASER PROCESSING METHOD AND LASER PROCESSING MACHINE
(FR) PROCÉDÉ DE TRAITEMENT AU LASER ET MACHINE DE TRAITEMENT AU LASER
(JA) レーザ加工方法及びレーザ加工装置
Abstract
(EN)
The present invention provides a laser processing method by which laser processing can be performed at a high speed with high accuracy. Provided is a laser processing method for processing an object to be processed by using a laser processing device, the laser processing method including: a step of emitting laser light; a step of modulating a phase of the laser light in such a manner that a plurality of laser spots are formed on a processed surface of the object to be processed; a step of collecting, on the processed surface, the laser light, the phase of which is modulated; and a step of causing the objective lens and the object to be processed to move relatively in such a manner that the plurality of laser spots are in trepanning orbit on the processed surface. In the step of causing the relative movement, the objective lens and the object to be processed are moved relatively in such a manner that 0
(FR)
La présente invention concerne un procédé de traitement au laser grâce auquel un traitement au laser peut être effectué très rapidement et avec une grande précision. L'invention concerne un procédé de traitement au laser permettant de traiter un objet à traiter à l'aide d'un dispositif de traitement au laser, le procédé de traitement au laser comprenant : une étape d'émission de lumière laser ; une étape de modulation d'une phase de la lumière laser de sorte qu'une pluralité de points laser soient formés sur une surface traitée de l'objet à traiter ; une étape de collecte, sur la surface traitée, de la lumière laser, dont la phase est modulée ; et une étape consistant à amener l’objectif et l'objet à traiter à se déplacer l’un par rapport à l’autre de sorte que la pluralité de points laser décrivent une orbite de trépanage sur la surface traitée. Dans l'étape consistant à provoquer le mouvement relatif, l’objectif et l'objet à traiter sont déplacés l’un par rapport à l’autre de manière à satisfaire à 0<Dt/DI<100, un diamètre de l'orbite de trépanage étant représenté par Dt, et un diamètre du point laser est représenté par DI.
(JA)
レーザ加工を高速かつ高精度で行うことが可能なレーザ加工方法を提供する。レーザ加工方法は、レーザ加工装置を用いて対象物を加工するレーザ加工方法であって、レーザ光を出射する工程と、対象物の加工面上において複数のレーザスポットが形成されるように前記レーザ光の位相を変調する工程と、位相が変調された前記レーザ光を前記加工面上に集光する工程と、前記複数のレーザスポットが前記加工面上においてトレパニング軌道を描くように、前記対物レンズと前記対象物とを相対移動させる工程と、を含み、前記相対移動させる工程は、前記トレパニング軌道の直径をDtとし、前記レーザスポットの直径をDIとしたときに、0<Dt/DI<100を満たすように前記対物レンズと前記対象物とを相対移動させる。
Also published as
Latest bibliographic data on file with the International Bureau