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1. WO2020110741 - RADAR DEVICE

Publication Number WO/2020/110741
Publication Date 04.06.2020
International Application No. PCT/JP2019/044627
International Filing Date 14.11.2019
IPC
G01S 7/03 2006.01
GPHYSICS
01MEASURING; TESTING
SRADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
7Details of systems according to groups G01S13/, G01S15/, G01S17/127
02of systems according to group G01S13/58
03Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
H01L 23/36 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H01Q 13/02 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
QANTENNAS, i.e. RADIO AERIALS
13Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
02Waveguide horns
CPC
G01S 7/03
GPHYSICS
01MEASURING; TESTING
SRADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
7Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
02of systems according to group G01S13/00
03Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
H01L 23/36
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
H01Q 13/02
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
QANTENNAS, i.e. RADIO AERIALS
13Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
02Waveguide horns
Applicants
  • 日立オートモティブシステムズ株式会社 HITACHI AUTOMOTIVE SYSTEMS, LTD. [JP]/[JP]
Inventors
  • 八文字 望 YATSUMONJI Nozomi
  • 河野 務 KONO Tsutomu
  • 都留 康隆 TSURU Yasutaka
  • 寺田 大介 TERADA Daisuke
  • 阿部 博幸 ABE Hiroyuki
  • 中林 研司 NAKABAYASHI Kenji
Agents
  • 戸田 裕二 TODA Yuji
Priority Data
2018-22248828.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) RADAR DEVICE
(FR) DISPOSITIF RADAR
(JA) レーダ装置
Abstract
(EN)
Provided is a radar device capable of suppressing a rise in temperature of an electronic component. A radar device (1) comprises a substrate (10) provided with an MMIC chip (14) on one main surface (11), a horn (20) disposed on the one main surface (11) of the substrate (10), and a heat radiating plate (40) provided on the other main surface (12) of the substrate (10), wherein a heat radiating pattern (15) is formed on the one main surface (11) of the substrate (10), the MMIC chip (14) is connected to the heat radiating pattern (15) via a heat radiating grease (G1), and the horn (20) is connected to the heat radiating pattern (15) via a heat radiating grease (G2).
(FR)
L'invention concerne un dispositif radar capable de supprimer une élévation de température d'un composant électronique. Un dispositif radar (1) comprend un substrat (10) pourvu d'une puce MMIC (14) sur une surface principale (11), un pavillon (20) disposé sur ladite surface principale (11) du substrat (10), et une plaque de rayonnement de chaleur (40) disposée sur l'autre surface principale (12) du substrat (10), un motif de rayonnement de chaleur (15) est formé sur la surface principale (11) du substrat (10), la puce MMIC (14) est reliée au motif de rayonnement thermique (15) par l'intermédiaire d'une graisse de rayonnement thermique (G1), et le pavillon (20) est relié au motif de rayonnement thermique (15) par l'intermédiaire d'une graisse de rayonnement thermique (G2).
(JA)
電子部品の温度上昇を抑えることができるレーダ装置を提供すること。 一方の主面(11)にMMICチップ(14)が設けられた基板(10)と、基板(10)の一方の主面(11)に配置されたホーン(20)と、基板(10)の他方の主面(12)に設けられた放熱板(40)と、を備えたレーダ装置(1)であり、基板(10)の一方の主面(11)には放熱パターン(15)が形成されており、MMICチップ(14)が放熱グリス(G1)を介して放熱パターン(15)に接続されると共にホーン(20)が放熱グリス(G2)を介して放熱パターン(15)に接続されている。
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