Processing

Please wait...

Settings

Settings

Goto Application

1. WO2020110714 - DISPLAY PANEL, DISPLAY PANEL MANUFACTURING METHOD, AND SUBSTRATE

Publication Number WO/2020/110714
Publication Date 04.06.2020
International Application No. PCT/JP2019/044440
International Filing Date 12.11.2019
IPC
G09F 9/33 2006.01
GPHYSICS
09EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
33being semiconductor devices, e.g. diodes
G09F 9/00 2006.01
GPHYSICS
09EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
G09F 9/30 2006.01
GPHYSICS
09EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
H01L 21/768 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
71Manufacture of specific parts of devices defined in group H01L21/7086
768Applying interconnections to be used for carrying current between separate components within a device
H01L 21/82 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
78with subsequent division of the substrate into plural individual devices
82to produce devices, e.g. integrated circuits, each consisting of a plurality of components
H01L 29/786 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
29Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier; Capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof
66Types of semiconductor device
68controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified, or switched
76Unipolar devices
772Field-effect transistors
78with field effect produced by an insulated gate
786Thin-film transistors
CPC
G09F 9/00
GPHYSICS
09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
G09F 9/30
GPHYSICS
09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
G09F 9/33
GPHYSICS
09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
33being semiconductor devices, e.g. diodes
H01L 21/768
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
71Manufacture of specific parts of devices defined in group H01L21/70
768Applying interconnections to be used for carrying current between separate components within a device ; comprising conductors and dielectrics
H01L 21/82
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
78with subsequent division of the substrate into plural individual devices
82to produce devices, e.g. integrated circuits, each consisting of a plurality of components
H01L 29/786
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
29Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; ; Multistep manufacturing processes therefor
66Types of semiconductor device ; ; Multistep manufacturing processes therefor
68controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
76Unipolar devices ; , e.g. field effect transistors
772Field effect transistors
78with field effect produced by an insulated gate
786Thin film transistors, ; i.e. transistors with a channel being at least partly a thin film
Applicants
  • 株式会社ジャパンディスプレイ JAPAN DISPLAY INC. [JP]/[JP]
Inventors
  • 金谷 康弘 KANAYA, Yasuhiro
  • 池田 雅延 IKEDA, Masanobu
Agents
  • 特許業務法人スズエ国際特許事務所 S & S INTERNATIONAL PPC
Priority Data
2018-22107427.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) DISPLAY PANEL, DISPLAY PANEL MANUFACTURING METHOD, AND SUBSTRATE
(FR) ÉCRAN D'AFFICHAGE, PROCÉDÉ DE FABRICATION D'ÉCRAN D'AFFICHAGE ET SUBSTRAT
(JA) 表示パネル、表示パネルの製造方法、及び基板
Abstract
(EN)
A display panel which can easily be repaired, a display panel manufacturing method and a substrate are provided. This display panel is provided with a substrate, a first insulating layer, and multiple pixels each of which includes subpixels of multiple colors. Each of the subpixels has a driving transistor, a pixel electrode to which a signal with a controlled current value is applied from the driving transistor, and a light emitting element which is mounted on the pixel electrode. Each of the pixels has a mounting electrode positioned spaced away from the pixel electrode. The multiple pixels include first pixels in which the mounting electrode is electrically in a floating state.
(FR)
La présente invention concerne un écran d'affichage qui peut être facilement réparé, un procédé de fabrication de l'écran d'affichage et un substrat. Cet écran d'affichage est pourvu d'un substrat, d'une première couche isolante et de multiples pixels comprenant chacun des sous-pixels d'une pluralité de couleurs. Chacun des sous-pixels comporte un transistor d'attaque, une électrode de pixels à laquelle un signal présentant une valeur de courant régulée est appliqué à partir du transistor d'attaque, et un élément électroluminescent qui est monté sur l'électrode de pixels. Chacun des pixels a une électrode de montage positionnée à l'écart de l'électrode de pixels. La pluralité de pixels comprend des premiers pixels dans lesquels l'électrode de montage se maintient électriquement dans un état flottant.
(JA)
リペアを容易に行うことが可能な表示パネル、表示パネルの製造方法、及び基板を提供する。 表示パネルは、基板と、第1絶縁層と、それぞれ複数色の副画素を含む複数の画素と、を備える。各々の副画素は、駆動トランジスタと、上記駆動トランジスタから電流値が制御された信号が与えられる画素電極と、上記画素電極の上に実装された発光素子と、を有する。各々の画素は、上記画素電極に間隔を置いて位置した実装電極を有する。複数の画素のうち第1画素において、上記実装電極は、電気的にフローティング状態にある。
Also published as
Latest bibliographic data on file with the International Bureau