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1. WO2020110681 - SUBSTRATE TREATMENT DEVICE

Publication Number WO/2020/110681
Publication Date 04.06.2020
International Application No. PCT/JP2019/044108
International Filing Date 11.11.2019
IPC
H01L 21/027 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
027Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
H01L 21/304 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/677 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677for conveying, e.g. between different work stations
CPC
H01L 21/027
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
H01L 21/304
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
18the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
302to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/677
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
Applicants
  • 株式会社SCREENホールディングス SCREEN HOLDINGS CO., LTD. [JP]/[JP]
Inventors
  • ▲桑▼原 丈二 KUWAHARA Joji
Agents
  • 杉谷 勉 SUGITANI Tsutomu
Priority Data
2018-22583230.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SUBSTRATE TREATMENT DEVICE
(FR) DISPOSITIF DE TRAITEMENT DE SUBSTRAT
(JA) 基板処理装置
Abstract
(EN)
This substrate treatment device (1) is provided with a main transporting mechanism (17), a first treatment part (31), a first transporting mechanism (27), a first transporting space, a second treatment part (61), a second transporting mechanism (57), and a detour transporting mechanism (41). The first transporting mechanism (27) is arranged between the main transporting mechanism (17) and the second transporting mechanism (57). The detour transporting mechanism (41) is arranged between the main transporting mechanism (17) and the second transporting mechanism (57). The main transporting mechanism (17) and the first transporting mechanism (27) can transport a substrate W to each other. The first transporting mechanism (27) and the second transporting mechanism (57) can transport the substrate W to each other. The main transporting mechanism (27) and the detour transporting mechanism (41) can transport the substrate W to each other. The detour transporting mechanism (41) and the second transporting mechanism (57) can transport the substrate W to each other.
(FR)
L'invention concerne un dispositif de traitement de substrat (1) comprenant un mécanisme de transport principal (17), une première partie de traitement (31), un premier mécanisme de transport (27), un premier espace de transport, une seconde partie de traitement (61), un second mécanisme de transport (57), et un mécanisme de transport de détour (41). Le premier mécanisme de transport (27) est disposé entre le mécanisme de transport principal (17) et le second mécanisme de transport (57). Le mécanisme de transport de détour (41) est disposé entre le mécanisme de transport principal (17) et le second mécanisme de transport (57). Le mécanisme de transport principal (17) et le premier mécanisme de transport (27) peuvent transporter un substrat W l'un vers l'autre. Le premier mécanisme de transport (27) et le second mécanisme de transport (57) peuvent transporter le substrat W l'un vers l'autre. Le mécanisme de transport principal (27) et le mécanisme de transport de détour (41) peuvent transporter le substrat W l'un vers l'autre. Le mécanisme de transport de détour (41) et le second mécanisme de transport (57) peuvent transporter le substrat W l'un vers l'autre.
(JA)
基板処理装置(1)は、主搬送機構(17)と第1処理部(31)と第1搬送機構(27)と第1搬送スペースと第2処理部(61)と第2搬送機構(57)と迂回搬送機構(41)とを備える。第1搬送機構(27)は、主搬送機構(17)と第2搬送機構(57)の間に配置される。迂回搬送機構(41)は、主搬送機構(17)と第2搬送機構(57)の間に配置される。主搬送機構(17)と第1搬送機構(27)は、相互に基板Wを搬送可能である。第1搬送機構(27)と第2搬送機構(57)は、相互に基板Wを搬送可能である。主搬送機構(27)と迂回搬送機構(41)は、相互に基板Wを搬送可能である。迂回搬送機構(41)と第2搬送機構(57)は、相互に基板Wを搬送可能である。
Also published as
Latest bibliographic data on file with the International Bureau