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1. WO2020110578 - MODULE

Publication Number WO/2020/110578
Publication Date 04.06.2020
International Application No. PCT/JP2019/042560
International Filing Date 30.10.2019
IPC
H01L 23/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
H01L 23/28 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
H01L 25/18 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
H01L 25/04 2014.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04the devices not having separate containers
CPC
H01L 23/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
H01L 23/28
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
H01L 25/04
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
H01L 25/18
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
18the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L51/00
Applicants
  • 株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP]/[JP]
Inventors
  • 佐藤 和茂 SATO, Kazushige
  • ▲高▼木 昌由 TAKAGI, Masayoshi
Agents
  • 特許業務法人深見特許事務所 FUKAMI PATENT OFFICE, P.C.
Priority Data
2018-22558330.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) MODULE
(FR) MODULE
(JA) モジュール
Abstract
(EN)
A module (101) according to the present invention is provided with: a substrate (1) which has a first main surface (1a); a first component (31) which is mounted on the first main surface (1a); a first land electrode (11) which is arranged on the first main surface (1a); a first mold resin (61) which is arranged so as to cover at least the first main surface (1a) and the first component (31); an upper shield film (5a) which is arranged so as to cover the upper surface of the first mold resin (61); a lateral shield film (5b) which is arranged so as to cover the lateral surface of the first mold resin (61); a first conductor column (71) which is arranged within the first mold resin (61) so as to electrically connect the first land electrode (11) and the upper shield film (5a) to each other; and an upper first bypass conductor (41) which is arranged within the first mold resin (61) so as to electrically connect the upper shield film (5a) and the lateral shield film (5b) to each other.
(FR)
La présente invention concerne un module (101) comprenant : un substrat (1) qui possède une première surface principale (1a) ; un premier composant (31) qui est monté sur la première surface principale (1a) ; une première électrode d'impact (11) qui est disposée sur la première surface principale (1a) ; une première résine de moule (61) qui est disposée de manière à recouvrir au moins la première surface principale (1a) et le premier composant (31) ; un film de protection supérieur (5a) qui est disposé de manière à recouvrir la surface supérieure de la première résine de moule (61) ; un film de protection latérale (5b) qui est disposé de manière à recouvrir la surface latérale de la première résine de moule (61) ; une première colonne de conducteur (71) qui est disposée à l'intérieur de la première résine de moule (61) de manière à relier électriquement la première électrode d'impact (11) et le film de protection supérieur (5a) l'un à l'autre ; et un premier conducteur de dérivation supérieur (41) qui est disposé à l'intérieur de la première résine de moule (61) de manière à relier électriquement le film de protection supérieur (5a) et le film de protection latérale (5b) l'un à l'autre.
(JA)
モジュール(101)は、第1主表面(1a)を有する基板(1)と、第1主表面(1a)に実装された第1部品(31)と、第1主表面(1a)に配置された第1ランド電極(11)と、少なくとも第1主表面(1a)および第1部品(31)を覆うように配置された第1モールド樹脂(61)と、第1モールド樹脂(61)の上面を覆うように設けられた上面シールド膜(5a)と、第1モールド樹脂(61)の側面を覆うように設けられた側面シールド膜(5b)と、第1ランド電極(11)と上面シールド膜(5a)とを電気的に接続するように第1モールド樹脂(61)内に配置された第1導体柱(71)と、上面シールド膜(5a)と側面シールド膜(5b)とを電気的に接続するように第1モールド樹脂(61)内に配置された上側第1バイパス導体(41)とを備える。
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