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1. WO2020110548 - DICING SHEET FOR PLASMA DICING

Publication Number WO/2020/110548
Publication Date 04.06.2020
International Application No. PCT/JP2019/042095
International Filing Date 28.10.2019
IPC
H01L 21/301 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 7/38 2018.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7Adhesives in the form of films or foils
30characterised by the adhesive composition
38Pressure-sensitive adhesives
C09J 133/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
133Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
C09J 201/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201Adhesives based on unspecified macromolecular compounds
CPC
C09J 133/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
133Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
C09J 201/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
201Adhesives based on unspecified macromolecular compounds
C09J 7/38
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
7Adhesives in the form of films or foils
30characterised by the adhesive composition
38Pressure-sensitive adhesives [PSA]
Applicants
  • リンテック株式会社 LINTEC CORPORATION [JP]/[JP]
Inventors
  • 森田 由希 MORITA Yuki
  • 福元 孝斉 FUKUMOTO Kosei
  • 西田 卓生 NISHIDA Takuo
Agents
  • 早川 裕司 HAYAKAWA Yuzi
  • 村雨 圭介 MURASAME Keisuke
  • 飯田 理啓 IIDA Michihiro
Priority Data
2018-22035726.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) DICING SHEET FOR PLASMA DICING
(FR) FEUILLE DE DÉCOUPAGE EN DÉS POUR DÉCOUPAGE EN DÉS AU PLASMA
(JA) プラズマダイシング用ダイシングシート
Abstract
(EN)
This dicing sheet for plasma dicing is provided with a base material and an adhesive layer that is layered on one surface side of the base material. When the dicing sheet for plasma dicing is left at rest for 60 minutes under the environment of an atmospheric pressure of 0.1 MPa and a temperature of 25°C, the mass decrease rate of the dicing sheet for plasma dicing is less than or equal to 0.4%. According to this dicing sheet for plasma dicing, it is possible to suppress peeling off of the dicing sheet from a supporting base at the time of plasma dicing.
(FR)
L'invention concerne une feuille de découpage en dés pour découpage en dés au plasma pourvue d'un matériau de base et d'une couche adhésive qui est stratifiée sur un côté surface du matériau de base. Lorsque la feuille de découpage en dés pour découpage en dés au plasma est laissée au repos pendant 60 minutes sous l'environnement d'une pression atmosphérique de 0,1 MPa et à une température de 25 °C, le taux de diminution de masse de la feuille de découpage en dés pour découpage en dés au plasma est inférieur ou égal à 0,4 %. Selon cette feuille de découpage en dés pour découpage en dés au plasma, il est possible de supprimer le décollement de la feuille de découpage en dés d'une base de support au moment du découpage en dés au plasma.
(JA)
基材と、前記基材における片面側に積層された粘着剤層とを備えるプラズマダイシング用ダイシングシートであって、前記プラズマダイシング用ダイシングシートを気圧0.1MPaおよび温度25℃の環境下に60分間静置した場合における、前記プラズマダイシング用ダイシングシートの質量減少率が、0.4%以下であるプラズマダイシング用ダイシングシート。かかるプラズマダイシング用ダイシングシートによれば、プラズマダイシングの際において、ダイシングシートの支持台からの剥がれを抑制することができる。
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