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1. WO2020110544 - ALUMINUM ALLOY SUBSTRATE FOR MAGNETIC DISCS AND METHOD FOR MANUFACTURING SAME, MAGNETIC DISC ALUMINUM ALLOY BASE AND METHOD FOR MANUFACTURING SAME, AND MAGNETIC DISC AND METHOD FOR MANUFACTURING SAME

Publication Number WO/2020/110544
Publication Date 04.06.2020
International Application No. PCT/JP2019/041970
International Filing Date 25.10.2019
IPC
G11B 5/73 2006.01
GPHYSICS
11INFORMATION STORAGE
BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
5Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
62Record carriers characterised by the selection of the material
73Base layers
C22C 21/00 2006.01
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
21Alloys based on aluminium
C22F 1/04 2006.01
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS
1Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
04of aluminium or alloys based thereon
C23C 18/18 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, i.e. electroless plating
18Pretreatment of the material to be coated
C23C 18/31 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, i.e. electroless plating
31Coating with metals
C23C 18/36 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, i.e. electroless plating
31Coating with metals
32Coating with one of iron, cobalt or nickel; Coating with mixtures of phosphorus or boron with one of these metals
34using reducing agents
36using hypophosphites
CPC
C22C 21/00
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
21Alloys based on aluminium
C22C 21/10
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
21Alloys based on aluminium
10with zinc as the next major constituent
C22C 21/12
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
21Alloys based on aluminium
12with copper as the next major constituent
C22F 1/00
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
1Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
C22F 1/04
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
1Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
04of aluminium or alloys based thereon
C23C 18/18
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
18Pretreatment of the material to be coated
Applicants
  • 株式会社UACJ UACJ CORPORATION [JP]/[JP]
  • 古河電気工業株式会社 FURUKAWA ELECTRIC CO., LTD. [JP]/[JP]
Inventors
  • 村田 拓哉 MURATA Takuya
  • 北脇 高太郎 KITAWAKI Kotaro
  • 米光 誠 YONEMITSU Makoto
  • 畠山 英之 HATAKEYAMA Hideyuki
  • 坂本 遼 SAKAMOTO Ryo
  • 太田 裕己 OTA Hiroki
Agents
  • 木村 満 KIMURA MITSURU
Priority Data
2018-22075026.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ALUMINUM ALLOY SUBSTRATE FOR MAGNETIC DISCS AND METHOD FOR MANUFACTURING SAME, MAGNETIC DISC ALUMINUM ALLOY BASE AND METHOD FOR MANUFACTURING SAME, AND MAGNETIC DISC AND METHOD FOR MANUFACTURING SAME
(FR) SUBSTRAT EN ALLIAGE D'ALUMINIUM POUR DISQUES MAGNÉTIQUES ET SON PROCÉDÉ DE FABRICATION, BASE EN ALLIAGE D'ALUMINIUM À DISQUE MAGNÉTIQUE ET SON PROCÉDÉ DE FABRICATION, ET DISQUE MAGNÉTIQUE ET SON PROCÉDÉ DE FABRICATION
(JA) 磁気ディスク用アルミニウム合金基板及びその製造方法、磁気ディスク用アルミニウム合金基盤及びその製造方法、ならびに、磁気ディスク及びその製造方法
Abstract
(EN)
This aluminum alloy substrate for magnetic discs is characterized by containing an aluminum alloy that contains 0.1-3.0 mass% of Fe, 0.005-1.000 mass% of Cu, and 0.005-1.000 mass% of Zn, the remaining portion being Al and unavoidable impurities, wherein, in the outer circumferential surface, pores having a longest diameter of not less than 10 µm exist in an amount of 200 pores/mm2. This magnetic disc aluminum alloy base and this magnetic disc use said aluminum alloy substrate for magnetic discs. This method is for manufacturing those.
(FR)
L'invention concerne un substrat en alliage d'aluminium pour disques magnétiques qui est caractérisé en ce qu'il contient un alliage d'aluminium qui contient de 0,1 à 3,0 % en masse de Fe, de 0,005 à 1,000 % en masse de Cu, et de 0,005 à 1,000 % en masse de Zn, la partie restante étant de l'Al et des impuretés inévitables, dans laquelle, dans la surface circonférentielle externe, des pores présentant un diamètre le plus long d'au moins 10 µm existent dans une quantité de 200 pores/mm2. Cette base en alliage d'aluminium à disque magnétique et ce disque magnétique utilisent ledit substrat en alliage d'aluminium pour disques magnétiques. L'invention concerne également un procédé de fabrication de ceux-ci.
(JA)
Fe:0.1~3.0mass%、Cu:0.005~1.000mass%、Zn:0.005~1.000mass%を含有し、残部Al及び不可避不純物からなるアルミニウム合金からなり、外周面において、最長径10μm以上の孔が200個/mm以下であることを特徴とする磁気ディスク用アルミニウム合金基板、これを用いた磁気ディスク用アルミニウム合金基盤及び磁気ディスク、ならびに、これらの製造方法。
Also published as
Latest bibliographic data on file with the International Bureau