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1. WO2020110493 - EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF

Publication Number WO/2020/110493
Publication Date 04.06.2020
International Application No. PCT/JP2019/040648
International Filing Date 16.10.2019
IPC
C08G 59/62 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40characterised by the curing agents used
62Alcohols or phenols
C08G 59/68 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
68characterised by the catalysts used
C08J 5/24 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5Manufacture of articles or shaped materials containing macromolecular substances
24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
CPC
C08G 59/22
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; ; e.g. general methods of curing
20characterised by the epoxy compounds used
22Di-epoxy compounds
C08G 59/58
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; ; e.g. general methods of curing
40characterised by the curing agents used
50Amines
56together with other curing agents
58with polycarboxylic acids or with anhydrides, halides, or low-molecular-weight esters thereof
C08G 59/62
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; ; e.g. general methods of curing
40characterised by the curing agents used
62Alcohols or phenols
C08G 59/68
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; ; e.g. general methods of curing
68characterised by the catalysts used
C08J 5/24
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G
5Manufacture of articles or shaped materials containing macromolecular substances
24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
Applicants
  • 住友化学株式会社 SUMITOMO CHEMICAL COMPANY, LIMITED [JP]/[JP]
Inventors
  • 加藤 洋史 KATO, Hirofumi
  • 竹内 謙一 TAKEUCHI, Kenichi
Agents
  • 特許業務法人深見特許事務所 FUKAMI PATENT OFFICE, P.C.
Priority Data
2018-22097827.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF
(FR) COMPOSITION DE RÉSINE ÉPOXY ET PRODUIT DURCI CORRESPONDANT
(JA) エポキシ樹脂組成物及びその硬化物
Abstract
(EN)
Provided are: an epoxy resin composition including an epoxy resin (A), a curing agent (B) that includes a compound represented by formula (B-1) [in the formula, R1 represents a hydrogen atom, a halogen atom, a methoxy group, or a C1-12 hydrocarbon group], and an imidazole-adduct-type curing accelerator (C), wherein the molar ratio of the phenolic hydroxyl group content to the epoxy group content in the epoxy resin composition is 0.25-0.67; and a cured product of the epoxy resin composition.
(FR)
L'invention concerne : une composition de résine époxy comprenant une résine époxy (A), un agent de durcissement (B) qui comprend un composé représenté par la formule (B-1) [dans la formule, R1 représente un atome d'hydrogène, un atome d'halogène, un groupe méthoxy ou un groupe hydrocarboné en C1-12] et un accélérateur de durcissement de type produit d'addition d'imidazole (C), le rapport molaire de la teneur en groupes hydroxyle phénolique à la teneur en groupes époxy dans la composition de résine époxy étant de 0,25-0,67 ; et un produit durci de la composition de résine époxy.
(JA)
エポキシ樹脂(A)、下記式(B-1)[式中、Rは、水素原子、ハロゲン原子、メトキシ基又は炭素数1~12の炭化水素基を表す。]で表される化合物を含む硬化剤(B)、及びイミダゾールアダクト型硬化促進剤(C)を含むエポキシ樹脂組成物であって、エポキシ樹脂組成物中のエポキシ基含有量に対するフェノール性水酸基含有量のモル比が0.25~0.67であるエポキシ樹脂組成物、並びに、その硬化物が提供される。
Also published as
Latest bibliographic data on file with the International Bureau