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1. WO2020110453 - PHOTOSENSITIVE CONDUCTIVE PASTE, FILM FOR USE IN CONDUCTIVE PATTERN FORMING, AND LAYERED MEMBER

Publication Number WO/2020/110453
Publication Date 04.06.2020
International Application No. PCT/JP2019/038521
International Filing Date 30.09.2019
IPC
G03F 7/004 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
G03F 7/027 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
G03F 7/09 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
09characterised by structural details, e.g. supports, auxiliary layers
H01B 1/20 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
H01B 5/14 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
5Non-insulated conductors or conductive bodies characterised by their form
14comprising conductive layers or films on insulating-supports
H05K 1/09 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
09Use of materials for the metallic pattern
CPC
G03F 7/004
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
G03F 7/027
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
G03F 7/09
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
09characterised by structural details, e.g. supports, auxiliary layers
H01B 1/20
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
H01B 5/14
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
5Non-insulated conductors or conductive bodies characterised by their form
14comprising conductive layers or films on insulating-supports
H05K 1/09
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
09Use of materials for the ; conductive, e.g. ; metallic pattern
Applicants
  • 東レ株式会社 TORAY INDUSTRIES, INC. [JP]/[JP]
Inventors
  • 伊月直秀 ITSUKI, Naohide
  • 水口創 MIZUGUCHI, Tsukuru
Priority Data
2018-22465330.11.2018JP
2018-22465430.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) PHOTOSENSITIVE CONDUCTIVE PASTE, FILM FOR USE IN CONDUCTIVE PATTERN FORMING, AND LAYERED MEMBER
(FR) PÂTE CONDUCTRICE PHOTOSENSIBLE, FILM DESTINÉ À ÊTRE UTILISÉ DANS LA FORMATION DE MOTIFS CONDUCTEURS, ET ÉLÉMENT EN COUCHES
(JA) 感光性導電ペーストおよび導電パターン形成用フィルム並びに積層部材
Abstract
(EN)
Provided are a photosensitive conductive paste, a film for use in conductive pattern forming, and a layered member, allowing for microfabrication and capable of suppressing a drop in conductivity in a metal fiber-containing transparent electrode under a high temperature and high humidity environment. The photosensitive conductive paste comprises an organometallic compound (A), a carboxyl group-containing resin (B), a photopolymerization initiator (C), a compound (D) having an unsaturated double bond, and conductive particles (E). In addition, the layered member has a transparent electrode layer including a binder resin (X) and metal fibers over a base material, at least some of the metal fibers being exposed, and a conductive layer, and the conductive layer comprises a cured product of a composition containing the organometallic compound (A), a binder resin (Y), and the conductive particles (E).
(FR)
L'invention concerne une pâte conductrice photosensible, un film destiné à être utilisé dans la formation de motifs conducteurs et un élément en couches qui permettent la microfabrication et qui sont capables d'éliminer une chute de conductivité dans une électrode transparente contenant des fibres métalliques dans un environnement à température et à humidité élevées. La pâte conductrice photosensible comprend un composé organométallique (A), une résine contenant un groupe carboxyle (B), un initiateur de photopolymérisation (C), un composé (D) possédant une double liaison insaturée, et des particules conductrices (E). De plus, l'élément en couches comporte une couche d'électrodes transparentes comprenant une résine liante (X) et des fibres métalliques sur un matériau de base, au moins certaines des fibres métalliques étant exposées, ainsi qu'une couche conductrice, la couche conductrice comprenant un produit durci d'une composition contenant le composé organométallique (A), une résine liante (Y) et les particules conductrices (E).
(JA)
微細加工可能で、金属繊維含有透明電極の高温高湿環境下における導電性低下を抑制することができる感光性導電ペーストおよび導電パターン形成用フィルム並びに積層部材を提供する。 有機金属化合物(A)、カルボキシル基含有樹脂(B)、光重合開始剤(C)、不飽和二重結合を有する化合物(D)および導電性粒子(E)を含有する感光性導電ペーストである。また、基材上に、バインダー樹脂(X)および金属繊維を含有し、該金属繊維の少なくとも一部が露出した透明電極層と、導電層とを有する積層部材であって、前記導電層が、有機金属化合物(A)、バインダー樹脂(Y)および導電性粒子(E)を含有する組成物の硬化物からなる積層部材である。
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