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1. WO2020110421 - FLEXIBLE SUBSTRATE

Publication Number WO/2020/110421
Publication Date 04.06.2020
International Application No. PCT/JP2019/035580
International Filing Date 10.09.2019
IPC
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
G09F 9/30 2006.01
GPHYSICS
09EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
H05K 1/03 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
H05K 3/28 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
CPC
G09F 9/30
GPHYSICS
09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
H05K 1/02
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 1/03
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
H05K 3/28
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
Applicants
  • 株式会社ジャパンディスプレイ JAPAN DISPLAY INC. [JP]/[JP]
Inventors
  • 佐野 匠 SANO, Takumi
Agents
  • 特許業務法人スズエ国際特許事務所 S & S INTERNATIONAL PPC
Priority Data
2018-22366329.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) FLEXIBLE SUBSTRATE
(FR) SUBSTRAT SOUPLE
(JA) フレキシブル基板
Abstract
(EN)
A flexible substrate according to one embodiment of the present invention is provided with: a flexible insulating base material which has a first surface and a second surface that is on the reverse side of the first surface; a plurality of wiring lines that are provided on the second surface of the insulating base material; a first low rigidity layer which has a first inner surface that faces the first surface and a first outer surface that is on the reverse side of the first inner surface; a second low rigidity layer which has a second inner surface that faces the second surface, with the wiring lines being interposed therebetween, and a second outer surface that is on the reverse side of the second inner surface; a first high rigidity layer which is in contact with the first outer surface, while having a higher elastic modulus than the first low rigidity layer; and a second high rigidity layer which is in contact with the second outer surface, while having a higher elastic modulus than the second low rigidity layer. With respect to this flexible substrate, the elastic modulus of the first low rigidity layer and the elastic modulus of the second low rigidity layer are lower than the elastic modulus of the insulating base material.
(FR)
Selon un mode de réalisation de la présente invention, un substrat souple comprend : un matériau de base isolant souple qui a une première surface et une seconde surface qui est sur le côté inverse de la première surface ; une pluralité de lignes de câblage qui sont disposées sur la seconde surface du matériau de base isolant ; une première couche à faible rigidité qui a une première surface interne qui fait face à la première surface et une première surface externe qui est sur le côté inverse de la première surface interne ; une seconde couche à faible rigidité qui a une seconde surface interne qui fait face à la seconde surface, les lignes de câblage étant interposées entre celles-ci, et une seconde surface externe qui est sur le côté inverse de la seconde surface interne ; une première couche à rigidité élevée qui est en contact avec la première surface externe, tout en ayant un module d'élasticité supérieur à celui de la première couche à faible rigidité ; et une seconde couche à rigidité élevée qui est en contact avec la seconde surface externe, tout en ayant un module d'élasticité supérieur à celui de la seconde couche à faible rigidité. Par rapport à ce substrat souple, le module d'élasticité de la première couche à faible rigidité et le module d'élasticité de la seconde couche à faible rigidité sont inférieurs au module d'élasticité du matériau de base isolant.
(JA)
本実施形態に係るフレキシブル基板は、第1面と前記第1面の反対側の第2面とを有する可撓性の絶縁基材と、前記絶縁基材の前記第2面側に設けられた複数の配線と、前記第1面と対向する第1内面と前記第1内面とは反対側の第1外面とを有する第1低剛性層と、前記配線を間に介して前記第2面と対向する第2内面と前記第2内面とは反対側の第2外面とを有する第2低剛性層と、前記第1外面に接し、前記第1低剛性層より大きい弾性率を有する第1高剛性層と、前記第2外面に接し、前記第2低剛性層より大きい弾性率を有する第2高剛性層と、を備え、前記第1低剛性層の弾性率及び前記第2低剛性層の弾性率は、それぞれ前記絶縁基材の弾性率より小さい。
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