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1. WO2020110287 - ELECTRICAL CONNECTION MEMBER, ELECTRICAL CONNECTION STRUCTURE, AND METHOD FOR PRODUCING ELECTRICAL CONNECTION MEMBER

Publication Number WO/2020/110287
Publication Date 04.06.2020
International Application No. PCT/JP2018/044162
International Filing Date 30.11.2018
IPC
H01L 21/60 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
B23K 20/04 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
20Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
04by means of a rolling mill
H01L 23/48 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
CPC
B23K 20/04
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
20Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
04by means of a rolling mill
H01L 23/48
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
Applicants
  • 日立金属株式会社 HITACHI METALS, LTD. [JP]/[JP]
Inventors
  • 仁科 順矢 NISHINA, Junya
  • 石尾 雅昭 ISHIO, Masaaki
Agents
  • 宮園 博一 MIYAZONO, Hirokazu
Priority Data
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ELECTRICAL CONNECTION MEMBER, ELECTRICAL CONNECTION STRUCTURE, AND METHOD FOR PRODUCING ELECTRICAL CONNECTION MEMBER
(FR) ÉLÉMENT DE CONNEXION ÉLECTRIQUE, STRUCTURE DE CONNEXION ÉLECTRIQUE ET PROCÉDÉ DE PRODUCTION D'ÉLÉMENT DE CONNEXION ÉLECTRIQUE
(JA) 電気接続用部材、電気接続構造、および電気接続用部材の製造方法
Abstract
(EN)
This electrical connection member (1, 301, 401, 501, 601) is provided with a cladding material (10, 110, 610) obtained by joining at least: a first Cu layer (12) formed from a Cu material; and a low thermal expansion layer (11) formed from an Fe material or an Ni material having an average thermal expansion coefficient between room temperature and 300°C that is lower than that of the first Cu layer.
(FR)
La présente invention concerne un élément de connexion électrique (1, 301, 401, 501, 601) qui est pourvu d'un matériau de gainage (10, 110, 610) obtenu par assemblage d'au moins : une première couche de Cu (12) formée à partir d'un matériau Cu ; et une couche à faible dilatation thermique (11) formée à partir d'un matériau Fe ou d'un matériau Ni ayant un coefficient de dilatation thermique moyen, entre la température ambiante et 300 °C, qui est inférieur à celui de la première couche de Cu.
(JA)
この電気接続用部材(1、301、401、501、601)は、Cu材から構成される第1Cu層(12)と、室温から300℃までの平均熱膨張係数が第1Cu層よりも小さいFe材またはNi材から構成される低熱膨張層(11)とが少なくとも接合されたクラッド材(10、110、610)を備える。
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