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1. WO2020110271 - METHOD FOR PRODUCING BONDED OBJECT AND SEMICONDUCTOR DEVICE AND COPPER BONDING PASTE

International Application Status
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03.08.2020International Application Status ReportHTML, PDF, XMLPDF, XML
Published International Application
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04.06.2020Initial Publication with ISR( (A1 23/2020))PDF (40p.)PDF (40p.), ZIP(XML + TIFFs), FullText
Search and Examination-Related Documents
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04.06.2020(ISA/210) International Search ReportPDF (3p.)PDF (3p.), ZIP(XML + TIFFs)
04.06.2020Translation of the ISRPDF (2p.)PDF (2p.), ZIP(XML + TIFFs)
04.06.2020(ISA/237) Written Opinion of the International Searching AuthorityPDF (4p.)PDF (4p.), ZIP(XML + TIFFs)
Related Documents on file at the International Bureau
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23.06.2020(IB/308) Notice Informing the Applicant of the Communication of the International Application to the Designated OfficesPDF (1p.)PDF (1p.), ZIP(XML + TIFFs)
04.06.2020(IB/311) Notification Concerning Availability of Publication of the International ApplicationPDF (1p.)PDF (1p.), ZIP(XML + TIFFs)
04.06.2020(RO/101) Request formPDF (5p.)
04.06.2020(IB/301) Notification of receipt of record copyPDF (1p.)PDF (1p.), ZIP(XML + TIFFs)
04.06.2020Application Body as FiledPDF (35p.)PDF (35p.), ZIP(XML + TIFFs)
International application as filed