Processing

Please wait...

Settings

Settings

Goto Application

1. WO2020109954 - LOW DIELECTRIC CONSTANT CURABLE COMPOSITIONS

Publication Number WO/2020/109954
Publication Date 04.06.2020
International Application No. PCT/IB2019/060086
International Filing Date 22.11.2019
IPC
C08G 77/442 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
77Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
42Block- or graft-polymers containing polysiloxane sequences
442containing vinyl polymer sequences
CPC
C08G 77/442
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
77Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
42Block-or graft-polymers containing polysiloxane sequences
442containing vinyl polymer sequences
Applicants
  • 3M INNOVATIVE PROPERTIES COMPANY [US]/[US]
Inventors
  • HARTMANN-THOMPSON, Claire
  • SCHWARTZ, Evan L.
  • BAETZOLD, John P.
Agents
  • OLOFSON, Jeffrey M.,
  • BLANK, Colene H.,
  • FLORCZAK, Yen Tong,
  • HARTS, Dean M. ,
  • LEVINSON, Eric D.,
  • MAKI, Eloise J.,
  • NOWAK, Sandra K.,
  • RINGSRED, Ted K.,
Priority Data
62/773,43630.11.2018US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) LOW DIELECTRIC CONSTANT CURABLE COMPOSITIONS
(FR) COMPOSITIONS DURCISSABLES À FAIBLE CONSTANTE DIÉLECTRIQUE
Abstract
(EN)
Low dielectric constant curable compositions include a first alkyl (meth)acrylate monomer with 12 or more carbon atoms, a crosslinking monomer, a copolymeric additive of a polyisobutylene-polysiloxane block copolymer, and at least one initiator. The curable composition is solvent free and inkjet printable. Upon curing the curable composition forms a non-crystalline, optically clear layer with a dielectric constant of less than or equal to 3.0 at 1 MegaHertz.
(FR)
La présente invention concerne des compositions durcissables à faible constante diélectrique comprenant un premier monomère (méth)acrylate d’alkyle comprenant 12 ou plusieurs atomes de carbone, un monomère de réticulation, un additif copolymère d’un copolymère séquencé de polyisobutylène-polysiloxane, et au moins un initiateur. La composition durcissable est exempte de solvant et peut être imprimée par jet d’encre. Lors du durcissement, la composition durcissable forme une couche non cristalline, optiquement claire avec une constante diélectrique inférieure ou égale à 3,0 à 1 mégahertz.
Latest bibliographic data on file with the International Bureau