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1. WO2020109947 - POLISHING PADS AND SYSTEMS AND METHODS OF MAKING AND USING THE SAME

Publication Number WO/2020/109947
Publication Date 04.06.2020
International Application No. PCT/IB2019/060064
International Filing Date 22.11.2019
IPC
B24B 37/00 2012.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
B24B 37/04 2012.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
04designed for working plane surfaces
B24B 37/22 2012.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
11Lapping tools
20Lapping pads for working plane surfaces
22characterised by a multi-layered structure
B24B 1/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
1Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
B24B 29/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
29Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
B24B 37/24 2012.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
11Lapping tools
20Lapping pads for working plane surfaces
24characterised by the composition or properties of the pad materials
CPC
B24B 37/04
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
04designed for working plane surfaces
B24B 37/22
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
11Lapping tools
20Lapping pads for working plane surfaces
22characterised by a multi-layered structure
B24B 37/24
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
11Lapping tools
20Lapping pads for working plane surfaces
24characterised by the composition or properties of the pad materials
Applicants
  • 3M INNOVATIVE PROPERTIES COMPANY [US]/[US]
Inventors
  • LEHUU, Duy K.
  • LIN, Qin
  • MURADIAN, David J.
  • JAVID, Samad
Agents
  • BRAMWELL, Adam M.
  • FLORCZAK, Yen Tong,
  • BLANK, Colene H.,
  • HARTS, Dean M. ,
  • LEVINSON, Eric D.,
  • MAKI, Eloise J.,
  • NOWAK, Sandra K.,
  • RINGSRED, Ted K.,
Priority Data
62/771,73827.11.2018US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) POLISHING PADS AND SYSTEMS AND METHODS OF MAKING AND USING THE SAME
(FR) TAMPONS À POLIR, SYSTÈMES ET PROCÉDÉS DE FABRICATION ET D'UTILISATION DE TELS TAMPONS À POLIR
Abstract
(EN)
A polishing pad includes a polishing layer having a first major surface and a second major surface opposite the first major surface. The polishing pad further includes a subpad, which is coupled to the polishing layer, and has a first major surface and a second major surface opposite the first major surface. At least 50% of the subpad, based on the total surface area of the first major surface of the subpad, is optically transparent.
(FR)
L'invention concerne un tampon à polir comprenant une couche de polissage comportant une première surface principale et une seconde surface principale opposée à la première surface principale. Le tampon à polir comprend en outre un sous-tampon, qui est accouplé à la couche de polissage, et comporte une première surface principale et une seconde surface principale opposée à la première surface principale. Au moins 50 % du sous-tampon, sur la base de la surface totale de la première surface principale du sous-tampon, est optiquement transparent.
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