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1. WO2020109614 - METHOD AND DEVICE FOR CREATING AT LEAST A PART OF ELECTRONIC CIRCUIT, AND ELECTRONIC CIRCUIT

Publication Number WO/2020/109614
Publication Date 04.06.2020
International Application No. PCT/EP2019/083194
International Filing Date 29.11.2019
IPC
H05K 3/10 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K 1/03 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
CPC
H05K 1/03
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
H05K 1/0386
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
0386Paper sheets
H05K 2201/0323
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
03Conductive materials
032Materials
0323Carbon
H05K 2203/107
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
10Using electric, magnetic and electromagnetic fields; Using laser light
107Using laser light
H05K 2203/108
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
10Using electric, magnetic and electromagnetic fields; Using laser light
107Using laser light
108Using a plurality of lasers or laser light with a plurality of wavelengths
H05K 2203/1136
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
11Treatments characterised by their effect, e.g. heating, cooling, roughening
1136Conversion of insulating material into conductive material, e.g. by pyrolysis
Applicants
  • MACSA ID, S.A. [ES]/[ES]
Inventors
  • SESHAIYA DORAISWAMY CHANDRASEKAR, Venkatesh
Agents
  • DURAN-CORRETJER, S.L.P.
Priority Data
202210630.11.2018NL
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHOD AND DEVICE FOR CREATING AT LEAST A PART OF ELECTRONIC CIRCUIT, AND ELECTRONIC CIRCUIT
(FR) PROCÉDÉ ET DISPOSITIF DE CRÉATION D'AU MOINS UNE PARTIE D'UN CIRCUIT ÉLECTRONIQUE, ET CIRCUIT ÉLECTRONIQUE
Abstract
(EN)
Method of creating at least a part of an electronic circuit, comprising the steps of providing at least one carbonizable substrate (4), in particular a cellulose based substrate, and position-selectively irradiating at least one part of the substrate to a temperature exceeding the carbonization temperature of said substrate, such that the irradiated part of the substrate is carbonized to form at least one electrically conductive track and/or pad; and device comprising: at least one irradiation source, in particular a laser (1), such as a C02 laser, being configured to position-selectively irradiate at least one part of a carbonizable substrate to a temperature exceeding the carbonization temperature of said substrate, such that the irradiated part of the substrate is carbonized to form at least one electrically conductive track and/or pad. The method can further comprise laser positioning system (2), electromagnetic beam (3), conveyor (5), rollers (6), microcontroller (7) and conductive tracks (8).
(FR)
L'invention concerne un procédé de création d'au moins une partie d'un circuit électronique consistant à utiliser au moins un substrat pouvant être carbonisé (4), en particulier un substrat à base de cellulose, et à irradier sélectivement au moins une partie du substrat à une température supérieure à la température de carbonisation dudit substrat, de telle sorte que la partie irradiée du substrat soit carbonisée pour former au moins une piste électroconductrice et/ou une pastille électroconductrice; ledit dispositif comprenant : au moins une source d'irradiation, en particulier un laser (1), tel qu'un laser à CO2, étant conçu pour irradier sélectivement au moins une partie d'un substrat pouvant être carbonisé à une température supérieure à la température de carbonisation dudit substrat, de telle sorte que la partie irradiée du substrat est carbonisée pour former au moins une piste électroconductrice et/ou une pastille électroconductrice. Le procédé peut en outre comprendre un système de positionnement laser (2), un faisceau électromagnétique (3), un transporteur (5), des rouleaux (6), un microcontrôleur (7) et des pistes conductrices (8).
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