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1. WO2020109467 - PRINTED CIRCUIT BOARD, ELECTRONIC COMPONENT, ELECTRICAL ENERGY STORE AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT

Publication Number WO/2020/109467
Publication Date 04.06.2020
International Application No. PCT/EP2019/082909
International Filing Date 28.11.2019
IPC
H05K 1/18 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
H05K 3/00 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
H05K 3/40 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
CPC
H01M 10/04
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
10Secondary cells; Manufacture thereof
04Construction or manufacture in general
H01M 10/425
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
10Secondary cells; Manufacture thereof
42Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
425Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
H01M 2/20
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
2Constructional details or processes of manufacture of the non-active parts
20Current conducting connections for cells
H01M 2/204
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
2Constructional details or processes of manufacture of the non-active parts
20Current conducting connections for cells
202Interconnectors for or interconnection of the terminals of adjacent or distinct batteries or cells
204of small-sized cells or batteries, e.g. miniature battery or power cells, batteries or cells for portable equipment
H05K 1/02
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 1/11
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
Applicants
  • ROBERT BOSCH GMBH [DE]/[DE]
Inventors
  • DITTERT, Thomas
  • SCHAEFER, Robin
Priority Data
10 2018 220 435.728.11.2018DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) LEITERPLATTE, ELEKTRONISCHES BAUTEIL, ELEKTRISCHER ENERGIESPEICHER UND VERFAHREN ZUM HERSTELLEN EINES ELEKTRONISCHEN BAUTEILS
(EN) PRINTED CIRCUIT BOARD, ELECTRONIC COMPONENT, ELECTRICAL ENERGY STORE AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT
(FR) CARTE DE CIRCUIT IMPRIMÉ, COMPOSANT ÉLECTRONIQUE, ACCUMULATEUR D'ÉNERGIE ÉLECTRIQUE ET PROCÉDÉ DE FABRICATION D'UN COMPOSANT ÉLECTRONIQUE
Abstract
(DE)
Leiterplatte (1), elektronisches Bauteil (10),elektrischer Energiespeicher und Verfahren zum Herstellen eines elektronischen Bauteils (10) wobeidie Leiterplatte (1) die folgenden aufeinander gestapelten Lagen aufweist: - eine flexible erste Isolatorlage (2), - eine Leiterlage (4), - eine flexible zweite Isolatorlage (5), - eine Verbindungslage (6) und - eine zumindest teilweise elektrisch leitfähige starre Basislage (9).
(EN)
The invention relates to a printed circuit board (1), to an electronic component (10), to an electrical energy store, and to a method for producing an electronic component (10). The printed circuit board (1) has the following layers stacked one on the other: a flexible first insulating layer (2); a conductor layer (4); a flexible second insulating layer (5); a connecting layer (6); and a rigid base layer (9) that is at least partially electrically conductive.
(FR)
L'invention concerne une carte de circuit imprimé (1), un composant électronique (10), un accumulateur d'énergie électrique et un procédé pour fabriquer un composant électronique (10), la carte de circuit imprimé (1) présentant les couches empilées suivantes : – une première couche isolante souple (2), – une couche conductrice (4), – une deuxième couche isolante souple (5), – une couche de liaison (6) et – une couche de base (9) rigide au moins partiellement électroconductrice.
Also published as
Latest bibliographic data on file with the International Bureau