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1. WO2020109023 - LIGHT-EMITTING DEVICE AND METHOD OF PACKAGING THE SAME

Publication Number WO/2020/109023
Publication Date 04.06.2020
International Application No. PCT/EP2019/081365
International Filing Date 14.11.2019
IPC
H01L 33/56 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
56Materials, e.g. epoxy or silicone resin
H01L 33/54 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
54having a particular shape
CPC
H01L 33/54
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
54having a particular shape
H01L 33/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
56Materials, e.g. epoxy or silicone resin
Applicants
  • LUMILEDS HOLDING B.V. [NL]/[NL]
Inventors
  • PAN, Hui Ling
  • YEW, Hua Sin
  • YAN, Xinping
Agents
  • RUEBER, Bernhard
Priority Data
18215443.521.12.2018EP
PCT/CN2018/11810329.11.2018CN
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) LIGHT-EMITTING DEVICE AND METHOD OF PACKAGING THE SAME
(FR) DISPOSITIF ÉLECTROLUMINESCENT ET SON PROCÉDÉ D'ENCAPSULATION
Abstract
(EN)
A light-emitting device (100A) includes: a lead frame (110) including a die paddle (111) and a lead (112) spaced apart from each other; a light-emitting die (120) attached on the die paddle (111); a wire (130) bonding the light-emitting die (120) to the lead (112), wherein a first end (131) of the wire (130) and a region of the light-emitting die (120) to which the first end (131) of the wire (130) is bonded form a first necking area (141); a first resin cover (150a) covering the first necking area (141); and a second resin cover (160) covering the first resin cover (150a), the light-emitting die (120), and the wire (130). The first resin cover (150a) has a hardness lower than a hardness of the second resin cover (160).
(FR)
L'invention concerne un dispositif électroluminescent (100A) comprenant : une grille de connexion (110) comprenant une palette de puce (111) et un fil (112) espacés l'un de l'autre ; une puce électroluminescente (120) fixée sur la palette de puce (111) ; un fil (130) reliant la puce électroluminescente (120) au fil (112), une première extrémité (131) du fil (130) et une région de la puce électroluminescente (120) à laquelle la première extrémité (131) du fil (130) est liée forment une première zone de striction (141) ; un premier couvercle en résine (150a) recouvrant la première zone de striction (141) ; et un second couvercle en résine (160) recouvrant le premier couvercle en résine (150a), la puce électroluminescente (120) et le fil (130). Le premier couvercle en résine (150a) a une dureté inférieure à une dureté du second couvercle en résine (160).
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