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1. WO2020108925 - SENSOR AND PACKAGE ASSEMBLY THEREOF

Publication Number WO/2020/108925
Publication Date 04.06.2020
International Application No. PCT/EP2019/080169
International Filing Date 05.11.2019
IPC
B81C 1/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
CPC
B81B 7/00
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems; ; Auxiliary parts of microstructural devices or systems
B81B 7/02
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems; ; Auxiliary parts of microstructural devices or systems
02containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
B81C 1/00
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
B81C 1/0023
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
00015for manufacturing microsystems
00222Integrating an electronic processing unit with a micromechanical structure
0023Packaging together an electronic processing unit die and a micromechanical structure die
Applicants
  • ROBERT BOSCH GMBH [DE]/[DE]
Inventors
  • CHANG, Ken
  • CHUANG, Wallace
Priority Data
201821962250.326.11.2018CN
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) SENSOR AND PACKAGE ASSEMBLY THEREOF
(FR) CAPTEUR ET ENSEMBLE BOÎTIER ASSOCIÉ
Abstract
(EN)
Package assembly of a sensor, comprising: a redistribution layer having a first via that penetrates the layer; a first die and a sensing element electrically connected to the redistribution layer; a cover body located between the redistribution layer and the sensing element, wherein the cover body has a second via that penetrates the cover body, and the second via communicates with the first via; and a moulding compound that encapsulates the first die and the sensing element.
(FR)
La présente invention concerne un ensemble boîtier d'un capteur comprenant : une couche de redistribution ayant un premier trou d'interconnexion qui pénètre dans la couche ; une première puce et un élément de détection connectés électriquement à la couche de redistribution ; un corps de couvercle situé entre la couche de redistribution et l'élément de détection, le corps de couvercle ayant un second trou d'interconnexion qui pénètre dans le corps de couvercle et le second trou d'interconnexion communique avec le premier trou d'interconnexion ; et un composé de moulage qui encapsule la première puce et l'élément de détection.
Also published as
Latest bibliographic data on file with the International Bureau