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1. WO2020108924 - SENSOR AND PACKAGE ASSEMBLY THEREOF

Publication Number WO/2020/108924
Publication Date 04.06.2020
International Application No. PCT/EP2019/080147
International Filing Date 05.11.2019
IPC
B81C 1/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
CPC
B81B 2207/012
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2207Microstructural systems or auxiliary parts thereof
01comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
012the micromechanical device and the control or processing electronics being separate parts in the same package
B81B 2207/096
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2207Microstructural systems or auxiliary parts thereof
09Packages
091Arrangements for connecting external electrical signals to mechanical structures inside the package
094Feed-through, via
096through the substrate
B81B 7/00
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems; ; Auxiliary parts of microstructural devices or systems
B81C 1/00
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
B81C 1/0023
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
00015for manufacturing microsystems
00222Integrating an electronic processing unit with a micromechanical structure
0023Packaging together an electronic processing unit die and a micromechanical structure die
Applicants
  • ROBERT BOSCH GMBH [DE]/[DE]
Inventors
  • CHANG, Ken
  • CHUANG, Wallace
Priority Data
201811417117.426.11.2018CN
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) SENSOR AND PACKAGE ASSEMBLY THEREOF
(FR) CAPTEUR ET SON ENSEMBLE DE CONDITIONNEMENT
Abstract
(EN)
The present invention discloses a package assembly of a sensor, comprising: a redistribution layer comprising a first face and a second face opposite to each other; a first die electrically connected to the first face of the redistribution layer; a molding compound comprising a third face and a fourth face opposite to each other, wherein the third face of the molding compound is combined with the first face of the redistribution layer, and the molding compound encapsulates the first die on the side of the first face of the redistribution layer; and a sensing element electrically connected to the redistribution layer. The package assembly of the sensor allows more elements to be packaged together, and provides a better structural Support or provides a better heat distribution for the package assembly, and at the same time, reduces the volume and costs of the entire package assembly.
(FR)
La présente invention concerne un ensemble de conditionnement d’un capteur, comprenant : une couche de redistribution comprenant une première face et une deuxième face opposées l’une à l’autre ; une première puce connectée électriquement à la première face de la couche de redistribution ; un composé de moulage comprenant une troisième face et une quatrième face opposées l’une à l’autre, la troisième face du composé de moulage étant combinée à la première face de la couche de redistribution, et le composé de moulage encapsulant la première puce du côté de la première face de la couche de redistribution ; et un élément de détection connecté électriquement à la couche de redistribution. L’ensemble de conditionnement du capteur permet de conditionner plus d’éléments ensemble, et assure un meilleur support structurel ou assure une meilleure répartition de chaleur pour l’ensemble de conditionnement, et, en même temps, réduit le volume et les coûts de tout l’ensemble de conditionnement.
Also published as
Latest bibliographic data on file with the International Bureau