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1. WO2020108861 - DETERMINING A MARK LAYOUT ACROSS A PATTERNING DEVICE OR SUBSTRATE

Publication Number WO/2020/108861
Publication Date 04.06.2020
International Application No. PCT/EP2019/078529
International Filing Date 21.10.2019
IPC
G03F 7/20 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
G03F 9/00 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
9Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
CPC
G03F 7/70616
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
70483Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
70616Wafer pattern monitoring, i.e. measuring printed patterns or the aerial image at the wafer plane
G03F 9/00
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
9Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
G03F 9/7046
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
9Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
70for microlithography
7003Alignment type or strategy, e.g. leveling, global alignment
7046Strategy, e.g. mark, sensor or wavelength selection
Applicants
  • ASML NETHERLANDS B.V. [NL]/[NL]
Inventors
  • SMAL, Pavel
  • SOCHAL, Inez, Marlena
  • SARMA, Gautam
Agents
  • PETERS, John Antoine
Priority Data
18208217.226.11.2018EP
19171485.629.04.2019EP
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) DETERMINING A MARK LAYOUT ACROSS A PATTERNING DEVICE OR SUBSTRATE
(FR) DÉTERMINATION D'UNE DISPOSITION DE MARQUES À TRAVERS UN DISPOSITIF OU UN SUBSTRAT DE FORMATION DE MOTIFS
Abstract
(EN)
A method for determining a layout of mark positions across a patterning device or substrate, the method comprising: a) obtaining (502) a model configured to model data associated with measurements performed on the patterning device or substrate at one or more mark positions; b) obtaining (504) an initial mark layout (506) comprising initial mark positions; c) reducing (508) the initial mark layout by removal of one or more mark positions to obtain a plurality of reduced mark layouts (510), each reduced mark layout obtained by removal of a different mark position from the initial mark layout; d) determining (512) a model uncertainty metric associated with usage of the model for each reduced mark layout out of said plurality of reduced mark layouts; and e) selecting (514) one or more reduced mark layouts (516) based on its associated model uncertainty metric.
(FR)
L'invention concerne un procédé de détermination d'une disposition de positions de marque à travers un dispositif ou un substrat de formation de motifs, le procédé consistant à : a) obtenir (502) un modèle conçu pour modéliser des données associées à des mesures réalisées sur le dispositif ou le substrat de formation de motifs à une ou plusieurs positions de marque ; b) obtenir (504) une disposition de marque initiale (506) comprenant des positions de marque initiale ; c) réduire (508) la disposition de marque initiale par retrait d'une ou de plusieurs positions de marque pour obtenir une pluralité de dispositions de marque réduites (510), chaque disposition de marque réduite étant obtenue par retrait d'une position de marque différente de la disposition de marque initiale ; d) déterminer (512) une métrique d'incertitude de modèle associée à l'utilisation du modèle pour chaque disposition de marque réduite parmi ladite pluralité de dispositions de marque réduites ; et e) sélectionner (514) une ou plusieurs dispositions de marque réduites (516) sur la base de sa métrique d'incertitude de modèle associée.
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