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1. WO2020108846 - METHOD FOR OF MEASURING A FOCUS PARAMETER RELATING TO A STRUCTURE FORMED USING A LITHOGRAPHIC PROCESS

Publication Number WO/2020/108846
Publication Date 04.06.2020
International Application No. PCT/EP2019/078172
International Filing Date 17.10.2019
IPC
G03F 7/20 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
CPC
G01B 11/272
GPHYSICS
01MEASURING; TESTING
BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
11Measuring arrangements characterised by the use of optical means
26for measuring angles or tapers; for testing the alignment of axes
27for testing the alignment of axes
272using photoelectric detection means
G03F 7/70616
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
70483Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
70616Wafer pattern monitoring, i.e. measuring printed patterns or the aerial image at the wafer plane
G03F 7/70641
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
70483Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
70616Wafer pattern monitoring, i.e. measuring printed patterns or the aerial image at the wafer plane
70641Focus
Applicants
  • ASML NETHERLANDS B.V. [NL]/[NL]
Inventors
  • LI, Fahong
  • SOKOLOV, Sergei
Agents
  • BROEKEN, Petrus Henricus Johannes
Priority Data
18208291.726.11.2018EP
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHOD FOR OF MEASURING A FOCUS PARAMETER RELATING TO A STRUCTURE FORMED USING A LITHOGRAPHIC PROCESS
(FR) PROCÉDÉ DE MESURE D'UN PARAMÈTRE DE MISE AU POINT RELATIF À UNE STRUCTURE FORMÉE À L'AIDE D'UN PROCÉDÉ LITHOGRAPHIQUE
Abstract
(EN)
Disclosed is a method of measuring a focus parameter relating to formation of a structure using a lithographic process, and associated metrology device. The method comprises obtaining measurement data relating to a cross-polarized measurement of said structure; and determining a value for said focus parameter based on the measurement data.
(FR)
La présente invention concerne un procédé de mesure d'un paramètre de mise au point relatif à la formation d'une structure à l'aide d'un procédé lithographique, et un appareil de métrologie associé. Le procédé comprend l'obtention de données de mesure relatives à une mesure à polarisation croisée de ladite structure ; et la détermination d'une valeur pour ledit paramètre de mise au point sur la base des données de mesure.
Also published as
Latest bibliographic data on file with the International Bureau