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1. WO2020108743 - DEPOSITION SOURCE FOR DEPOSITING EVAPORATED MATERIAL, DEPOSITION APPARATUS, AND METHODS THEREFOR

Publication Number WO/2020/108743
Publication Date 04.06.2020
International Application No. PCT/EP2018/082796
International Filing Date 28.11.2018
IPC
C23C 14/24 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
24Vacuum evaporation
C23C 14/54 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
54Controlling or regulating the coating process
CPC
C23C 14/24
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
24Vacuum evaporation
C23C 14/546
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
54Controlling or regulating the coating process
542Controlling the film thickness or evaporation rate
545using measurement on deposited material
546using crystal oscillators
Applicants
  • APPLIED MATERIALS, INC. [US]/[US]
  • SALUGU, Srinivas [IN]/[IN] (US)
  • MÜLLER, Andreas [DE]/[DE] (US)
  • FRANKE, Sebastian [DE]/[DE] (US)
  • LOPP, Andreas [DE]/[DE] (US)
  • SCHÜSSLER, Uwe [DE]/[DE] (US)
  • AULBACH, Julian [DE]/[DE] (US)
Inventors
  • SALUGU, Srinivas
  • MÜLLER, Andreas
  • FRANKE, Sebastian
  • LOPP, Andreas
  • SCHÜSSLER, Uwe
  • AULBACH, Julian
Agents
  • ZIMMERMANN & PARTNER PATENTANWÄLTE MBB
Priority Data
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) DEPOSITION SOURCE FOR DEPOSITING EVAPORATED MATERIAL, DEPOSITION APPARATUS, AND METHODS THEREFOR
(FR) SOURCE DE DÉPÔT POUR DÉPOSER UN MATÉRIAU ÉVAPORÉ, APPAREIL DE DÉPÔT ET PROCÉDÉS ASSOCIÉS
Abstract
(EN)
A deposition source for depositing evaporated material is described. The deposition source (100) includes a distribution arrangement (110) having a plurality of outlets (111) for providing an evaporated first material (A) and an evaporated second material (B) in a main deposition direction (101). Additionally, the deposition source includes a measurement assembly (120) for measuring a first deposition rate of the evaporated first material (A) and for measuring a second deposition rate of the evaporated second material (B). The measurement assembly (120) has a main detection direction (102) being in a cross direction to the main deposition direction (101). Further, the deposition source (100) includes a separation element (130) for separating the evaporated first material (A) and the evaporated second material (B) in a cross direction to the main detection direction (102). The separation element (130) is arranged in the main detection direction (102) between the plurality of outlets (111) and the measurement assembly (120).
(FR)
La présente invention concerne une source de dépôt pour déposer un matériau évaporé. La source de dépôt (100) comprend un agencement de distribution (110) ayant une pluralité de sorties (111) pour fournir un premier matériau évaporé (A) et un deuxième matériau évaporé (B) dans une direction de dépôt principale (101). En outre, la source de dépôt comprend un ensemble de mesure (120) pour mesurer un premier taux de dépôt du premier matériau évaporé (A) et pour mesurer un deuxième taux de dépôt du deuxième matériau évaporé (B). L’ensemble de mesure (120) a une direction de détection principale (102) qui est dans une direction transversale par rapport à la direction de dépôt principale (101). En outre, la source de dépôt (100) comprend un élément de séparation (130) pour séparer le premier matériau évaporé (A) et le deuxième matériau évaporé (B) dans une direction transversale par rapport à la direction de détection principale (102). L’élément de séparation (130) est agencé dans la direction de détection principale (102) entre la pluralité de sorties (111) et l’ensemble de mesure (120).
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