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1. WO2020108543 - BACKLIGHT MODULE LIGHT SOURCE COMPONENT

Publication Number WO/2020/108543
Publication Date 04.06.2020
International Application No. PCT/CN2019/121351
International Filing Date 27.11.2019
IPC
G02F 1/13357 2006.01
GPHYSICS
02OPTICS
FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
1Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
01for the control of the intensity, phase, polarisation or colour
13based on liquid crystals, e.g. single liquid crystal display cells
133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
1333Constructional arrangements
1335Structural association of cells with optical devices, e.g. polarisers or reflectors
13357Illuminating devices
CPC
F21K 99/00
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
99Subject matter not provided for in other groups of this subclass
G02B 6/0003
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
0001specially adapted for lighting devices or systems
0003the light guides being doped with fluorescent agents
H01L 25/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
H01L 25/0753
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
075the devices being of a type provided for in group H01L33/00
0753the devices being arranged next to each other
H01L 33/50
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
50Wavelength conversion elements
Applicants
  • 深圳TCL新技术有限公司 SHENZHEN TCL NEW TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 强科文 QIANG, Kewen
  • 邓天应 DENG, Tianying
  • 陈细俊 CHEN, Xijun
  • 林型岁 LIN, Xingsui
  • 郑作成 ZHENG, Zuocheng
Agents
  • 深圳市君胜知识产权代理事务所(普通合伙) JOHNSON INTELLECTUAL PROPERTY AGENCY(SHENZHEN)
Priority Data
201811437234.728.11.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) BACKLIGHT MODULE LIGHT SOURCE COMPONENT
(FR) COMPOSANT DE SOURCE DE LUMIÈRE DE MODULE DE RÉTROÉCLAIRAGE
(ZH) 一种背光模组光源组件
Abstract
(EN)
A backlight module light source component, comprising a PCB (10) and an LED (40) provided on the PCB (10). The surface of the PCB (10) provided with the LED light source is provided with a white solder mask layer (20), and a yellow phosphor ink coating unit (30) which diffuses outwards with the LED (40) as the center is provided on the white solder mask layer (20). According to the backlight module light source component, a yellow phosphor ink coating is provided on the surface of the PCB (10) where the backlight LED (40) is located, the yellow phosphor ink coating achieves reflection, refraction, or diffuse reflection of the LED light source, and optimum reflection, refraction, or diffuse reflection of light from the LED light source are achieved by optimizing the design of the area ratio of the phosphor ink to the white solder mask layer (20) on the PCB (10), thereby effectively alleviating the problem of uneven color rendering and uneven brightness directly above the backlight LED (40).
(FR)
La présente invention concerne un composant de source de lumière de module de rétroéclairage, comprenant un PCB (10) et une DEL (40) disposée sur le PCB (10). La surface du PCB (10), pourvue de la source de lumière à DEL, est pourvue d'une couche de masque de soudure blanche (20) et d'une unité de revêtement d'encre de phosphore jaune (30) qui se diffuse vers l'extérieur avec la DEL (40) au fur et à mesure que le centre est disposé sur la couche de masque de soudure blanche (20). Selon le composant de source de lumière de module de rétroéclairage, un revêtement d'encre de phosphore jaune est disposé sur la surface du PCB (10) où la DEL de rétroéclairage (40) est située. Le revêtement d'encre de phosphore jaune permet d'obtenir une réflexion, une réfraction ou une réflexion diffuse de la source de lumière à DEL, et une réflexion, une réfraction ou une réflexion diffuse optimale de la lumière provenant de la source de lumière à DEL sont obtenues par optimisation de la conception du rapport de surface de l'encre de phosphore sur la couche de masque de soudure blanche (20) sur le PCB (10), ce qui permet d'atténuer efficacement le problème de rendu de couleur irrégulière et de luminosité irrégulière directement au-dessus de la DEL de rétroéclairage (40).
(ZH)
一种背光模组光源组件,包括PCB板(10)及设置于PCB板(10)上的LED(40);设置LED光源的PCB板(10)表面设置有白色阻焊层(20),在白色阻焊层(20)上设置有以LED(40)为中心向外扩散的黄色荧光粉油墨涂层单元(30)。背光模组光源组件采用在背光源LED(40)所处PCB板(10)表面设置荧光粉黄色油墨涂层,通过荧光粉黄色油墨涂层实现对LED光源进行反射、折射或漫反射,再通过荧光粉油墨和PCB板(10)上白色阻焊层(20)所占面积比例进行优化设计搭配让LED光源的光达到最佳的反射、折射或漫反射,有效改善背光源LED(40)正上方颜色显色不均匀和亮度明暗不均匀的问题。
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