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1. WO2020108501 - LED ARRAY AND LED DISPLAY SCREEN

Publication Number WO/2020/108501
Publication Date 04.06.2020
International Application No. PCT/CN2019/121092
International Filing Date 27.11.2019
IPC
H01L 33/62 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
62Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
CPC
G09F 9/33
GPHYSICS
09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
33being semiconductor devices, e.g. diodes
H01L 25/075
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
075the devices being of a type provided for in group H01L33/00
H01L 33/48
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
H01L 33/62
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Applicants
  • 深圳TCL新技术有限公司 SHENZHEN TCL NEW TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 李泽龙 LI, Zelong
  • 王代青 WANG, Daiqing
  • 强科文 QIANG, Kewen
  • 季洪雷 JI, Honglei
Agents
  • 深圳市君胜知识产权代理事务所(普通合伙) JOHNSON INTELLECTUAL PROPERTY AGENCY(SHENZHEN)
Priority Data
201811435962.428.11.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) LED ARRAY AND LED DISPLAY SCREEN
(FR) MATRICE DE LED ET ÉCRAN D'AFFICHAGE À LED
(ZH) LED阵列及LED显示屏
Abstract
(EN)
An LED array (100) and an LED display screen having the LED array (100). The LED array (100) comprises a PCB (10) and a plurality of light-emitting units (30) installed at the PCB (10). Each light-emitting unit (30) comprises a frame (31) and three LED chips (33). The three LED chips (33) are packaged in the frame (31) in a face down manner, and the frame (31) is installed at the PCB (10) in a face up manner, such that the LED chips (33) in the frame (31) are electrically connected to the PCB (10). In the invention, a frame (31) is installed at a PCB (10) in a face up manner after LED chips (33) have been packaged therein in a face down manner. Moving the step of flipping over the LED chips (33) forward can lower the requirement on precision of surface-mounting the LED chips (33), thereby effectively increasing the precision and yield of surface mounting.
(FR)
L'invention concerne une matrice de LED (100) et un écran d'affichage à LED comprenant la matrice de LED (100). La matrice de LED (100) comprend une PCB (10) et une pluralité d'unités électroluminescentes (30) installées au niveau de la PCB (10). Chaque unité électroluminescente (30) comprend un cadre (31) et trois puces de LED (33). Les trois puces de LED (33) sont emballées dans le cadre (31) face vers le bas, et le cadre (31) est installé au niveau de la PCB (10) de sorte que les puces de LED (33) dans le cadre (31) sont reliées électriquement à la PCB (10). Selon l'invention, un cadre (31) est installé au niveau d'une PCB (10) face vers le haut après que les puces de LED (33) ont été emballées dans celui-ci face vers le bas. Le fait d'avancer l'étape de retournement des puces de LED (33) peut réduire l'exigence de précision de montage en surface des puces de LED (33), ce qui permet d'augmenter efficacement la précision et le rendement du montage en surface.
(ZH)
一种LED阵列(100)及具有该LED阵列(100)的LED显示屏,该LED阵列(100)包括PCB板(10)以及装配在所述PCB板(10)上的若干发光单元(30),每一发光单元(30)包括一支架(31)以及三个LED芯片(33),三个所述LED芯片(33)采用倒装的方式封装在所述支架(31)内,所述支架(31)采用正装的方式装配在所述PCB板(10)上,使支架(31)内的LED芯片(33)与所述PCB板(10)电性连接。预先将LED芯片(33)倒装封装到支架(31)上后,支架(31)再采用正装的方式装配在PCB板(10)上,其将倒装LED芯片(33)的制程前移,从而降低LED芯片(33)在贴片时的精度要求,有效提高贴片的精度和良率。
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Latest bibliographic data on file with the International Bureau