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1. WO2020108315 - SIGNAL TRANSMISSION CIRCUIT AND METHOD, AND INTEGRATED CIRCUIT (IC)

Publication Number WO/2020/108315
Publication Date 04.06.2020
International Application No. PCT/CN2019/118465
International Filing Date 14.11.2019
IPC
H01L 23/48 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
H01L 21/768 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
71Manufacture of specific parts of devices defined in group H01L21/7086
768Applying interconnections to be used for carrying current between separate components within a device
H03K 19/0175 2006.01
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
KPULSE TECHNIQUE
19Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
0175Coupling arrangements; Interface arrangements
G01R 31/28 2006.01
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
G01R 31/317 2006.01
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
317Testing of digital circuits
CPC
G01R 31/28
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
G01R 31/317
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
317Testing of digital circuits
H01L 23/48
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
H01L 23/481
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
481Internal lead connections, e.g. via connections, feedthrough structures
H03K 19/0175
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
KPULSE TECHNIQUE
19Logic circuits, i.e. having at least two inputs acting on one output
0175Coupling arrangements; Interface arrangements
Applicants
  • CHANGXIN MEMORY TECHNOLOGIES, INC. [CN]/[CN]
Inventors
  • LIN, You-Hsien
Agents
  • SHANGHAI SAVVY INTELLECTUAL PROPERTY AGENCY
Priority Data
201811434151.228.11.2018CN
201822026617.728.11.2018CN
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) SIGNAL TRANSMISSION CIRCUIT AND METHOD, AND INTEGRATED CIRCUIT (IC)
(FR) CIRCUIT DE TRANSMISSION DE SIGNAL ET PROCÉDÉ, ET CIRCUIT INTÉGRÉ (IC)
Abstract
(EN)
A signal transmission circuit and method for testing an integrated circuit (IC) are disclosed. The signal transmission circuit includes: an input circuit, configured to generate a first test signal in response to a first control signal and a clock signal; a transfer chain, including multiple stages of serially-connected transfer circuits, where adjacent transfer circuits in the transfer chain are connected via a through silicon via (TSV), the transfer circuit on one end of the transfer chain is connected to the input circuit, and the multiple stages of transfer circuits transfer the first test signal in stage by stage in response to the clock signal; and multiple signal output ends, where a first test signal input end of each stage of transfer circuit is correspondingly connected to one signal output end. The signal transmission circuit improves the effective utilization rate of a chip in an IC having a TSV test circuit.
(FR)
L'invention concerne un circuit de transmission de signal et un procédé de test d'un circuit intégré (IC). Le circuit de transmission de signal comprend : un circuit d'entrée, configuré pour générer un premier signal de test en réponse à un premier signal de commande et un signal d'horloge ; une chaîne de transfert, comprenant de multiples étages de circuits de transfert montés en série, des circuits de transfert adjacents dans la chaîne de transfert étant connectés par l'intermédiaire d'un trou d'interconnexion à travers le silicium (TSV), le circuit de transfert situé sur une extrémité de la chaîne de transfert étant connecté au circuit d'entrée, et les multiples étages de circuits de transfert transférant le premier signal de test étage par étage en réponse au signal d'horloge ; et de multiples extrémités de sortie de signal, une première extrémité d'entrée de signal de test de chaque étage de circuit de transfert étant connectée de manière correspondante à une extrémité de sortie de signal. Le circuit de transmission de signal améliore le taux d'utilisation efficace d'une puce dans un circuit intégré comportant un circuit de test TSV.
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